Provided are an MEMS device, a head, and a liquid jet device in which substrates are inhibited from warping, so that a primary electrode and a secondary electrode can be reliably connected to each other. Included are a primary substrate 30 provided with a bump 32 including a primary electrode 34, and a secondary substrate 10 provided with a secondary electrode 91 on a bottom surface of a recessed portion 36 formed by an adhesive layer 35. The primary substrate 10 and the secondary substrate 30 are joined together with the adhesive layer 35, the primary electrode 34 is electrically connected to the secondary electrode 91 with the bump 32 inserted into the recessed portion 36, and part of the bump 32 and the adhesive layer 35 forming the recessed portion 36 overlap each other in a direction in which the bump 32 is inserted into the recessed portion 36.

There is provided a nozzle plate of an inkjet head, the nozzle plate including: a first surface that is bonded to an upper layer substrate by an adhesive; and a second surface in which an opening of a nozzle that ejects an ink is provided. A step is formed at an edge of the first surface.

An inkjet recording head comprising a flow channel member, wherein the flow channel member is formed of a heat-cured product of a molding material comprising a resin composition comprising a thermosetting epoxy resin and a curing agent, and a filler; the filler comprises alumina and silica; and with d50 as a median diameter of the silica and with alumina A as the alumina having a median diameter of d50/4 or less, the content of the alumina A is 11 parts by mass or more relative to 100 parts by mass of the silica.

There are provided a method of manufacturing a head chip capable of suppressing the occurrence of the failure in the process of forming the actuator plate to thereby increase the yield ratio, and a method of manufacturing a liquid jet head using the above method of manufacturing a head chip. The method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip having an actuator plate adapted to apply pressure to liquid so as to jet the liquid. Forming the actuator plate includes forming a plurality of grooves on a surface of a piezoelectric substrate having one end and the other end so as to extend from the one end side toward the other end side, forming a conductive film on the surface of the piezoelectric substrate provided with the plurality of grooves, forming a laser processing area in the conductive film between the grooves adjacent to each other by performing laser processing from a start point on the one end side of the piezoelectric substrate to an end point on the other end side, and forming a surface removal area in at least a part including the start point and the end point out of the surface of the piezoelectric substrate by performing surface removal processing in a direction crossing the direction in which the laser processing is performed.

In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.

In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.

An actuator includes a substrate, a diaphragm on the substrate, a lower electrode on the diaphragm, a piezoelectric body on the lower electrode, and an upper electrode on the piezoelectric body. A ratio of lead (Pb) and zirconium (Zr) in atomic percent (atm %) present at a grain boundary in the piezoelectric body satisfies a relation of Pb/Zr>1.7.

There is provided liquid discharging head including; channel member which includes plates stacked in a first direction and adhered to each other via adhesive, and in which individual channels each including nozzle and pressure chamber communicated with the nozzle is formed. The plates include first plate and second plate adhered to adhesion surface of the first plate via the adhesive. Hollows each construct one of the individual channels are opened in the adhesion surface. The hollows are arranged side by side in second direction orthogonal to the first direction in the adhesion surface, and three or more grooves are formed in the adhesion surface between two of the hollows adjacent to each other in the second direction, each of the three or more grooves extending in third direction which is orthogonal to the first direction and which crosses the second direction.

A liquid discharge head includes a flow passage member, a sealing member, and an actuator member. The flow passage member is formed with individual flow passages each including a nozzle and a pressure chamber and the flow passage member has a surface on which the pressure chamber is open. The sealing member is arranged on the surface and seals the pressure chamber. The actuator member has a piezoelectric layer, a driving electrode, and a high electric potential portion. The piezoelectric layer is adhered to a first surface of the sealing member on a side opposite to the flow passage member, via a first adhesive having an insulating property. The driving electrode is arranged on a side opposite to the sealing member with respect to the piezoelectric layer at a position overlapped with the pressure chamber in a first direction orthogonal to the surface.

A method for manufacturing a device for ejecting a fluid, including the steps of: forming, in a first semiconductor wafer that houses a nozzle of the ejection device, a first structural layer; removing selective portions of the first structural layer to form a first portion of a chamber for containing the fluid; removing, in a second semiconductor wafer that houses an actuator of the ejection device, selective portions of a second structural layer to form a second portion of the chamber; and coupling together the first and second semiconductor wafers so that the first portion directly faces the second portion, thus forming the chamber. The first portion defines a part of volume of the chamber that is larger than a respective part of volume of the chamber defined by the second portion.