Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.

A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate contains two or more arrays of nozzle holes therein and a barrier structure disposed on an exposed surface of the nozzle plate between adjacent arrays of nozzle holes, wherein the barrier structure deters cross-contamination of fluids between the adjacent arrays of nozzle holes.

A flow path structure which forms a flow path of liquid, includes: a light absorbing member (first substrate) having absorbing properties with respect to laser light; a light transmitting member (second substrate) which is joined to the light absorbing member and has transmitting properties with respect to the laser light; a first flow path (flow path) which is surrounded by a welding interface between the light absorbing member and the light transmitting member; and a second flow path which is formed in a flow path pipe (flow path pipe) which protrudes from a front surface opposite of the welding interface in the light transmitting member, and communicates with the first flow path, in which the flow path pipe is included in a region of the first flow path in a plan view from a direction orthogonal to the welding interface.

When a filter for example is provided in a liquid supply path in the manufacture of a liquid ejection head, the filter can be prevented from being displaced or deformed. A manufacture method of a liquid ejection head having a liquid ejection unit for ejecting liquid and a liquid supply unit for supplying liquid to the liquid ejection unit has a processing of abutting a filter to a melting unit provided in the liquid supply unit and applying heat to the melting unit via the filter to melt the melting unit to thereby fix the filter to the melting unit, and a processing of burying the melting unit fixed to the filter by molding material.

There is provided a nozzle plate of an inkjet head, the nozzle plate including: a first surface that is bonded to an upper layer substrate by an adhesive; and a second surface in which an opening of a nozzle that ejects an ink is provided. A step is formed at an edge of the first surface.

A bonding substrate is provided with nozzle communication channels that establish communication between pressure chambers and nozzles. Each nozzle communication channel includes a pair of first inner wall surfaces constituting wall surfaces in a first direction, and a pair of second inner wall surfaces constituting wall surfaces in a second direction being orthogonal to the first direction. At least one of the second inner wall surfaces includes an inclined surface being inclined such that a length of the nozzle communication channel becomes gradually shorter toward the nozzle. An angle of the inclined surface relative to a liquid ejecting surface where the nozzles are opened is smaller than an angle of the first inner wall surface relative to the liquid ejecting surface.

A microfluidic device has a chamber; a fluidic access channel in fluidic connection with the chamber; a plurality of nozzle apertures in fluidic connection with the chamber; and an actuator, operatively coupled to the fluid containment chamber and configured to cause ejection of drops of fluid through the nozzle apertures in an operating condition of the microfluidic device. The chamber has an elongated shape, with a length and a maximum width, wherein an aspect ratio between the length and the maximum width of the chamber is at least 3:1. The nozzle apertures are configured to generate, in use, a plurality of drops having a total drop volume, wherein a ratio total drop volume to a chamber volume is at least 15%.

In order to provide an inkjet head using an adhesive containing an epoxy resin as a main agent and an imidazole-based curing agent as a curing agent, capable of securing a time for joining work before curing, and having excellent long-term reliability, and a production method for the inkjet head, constituent members are bonded to each other by an adhesive containing at least an epoxy resin as a main agent, a microencapsulated imidazole-based curing agent as a curing agent, and an alcohol that dissolves the microcapsules at a low temperature, and preferably, a residue of the microcapsules dissolved by the alcohol is dispersed in the cured epoxy resin.

There is provided a method of manufacturing a liquid ejection head. The liquid ejection head includes a recording device substrate, an electric wiring member configured to be connected to the recording device substrate at an electric connection portion, and a support member including a concave portion and a convex portion. The convex portion includes a first surface and a second surface. The method includes applying an adhesive to the surface of the concave portion on which the recording device substrate is to be placed and to the first surface, pressing the applied adhesive after the recording device substrate is placed on the surface of the concave portion on which the recording device substrate is to be placed, to fill, with the adhesive, a gap between the convex portion and the recording device substrate to a position higher than the first surface, and sealing the electric connection portion.

A substrate joined body including: a first substrate; a second substrate; an organic film that comprises silicon and carbon and joins the first substrate and the second substrate; and a protective film that comprises an inorganic element and is formed over the organic film from at least a part of the surface of the first substrate and at least a part of the surface of the second substrate, wherein the protective film comprises a region in which the ratio of carbon to silicon based on atomic percentage is from 0.0 to 5.0 in a region within 50 nm in a thickness direction from a surface of the organic film on the protective film side, when the surface is measured by X-ray photoelectron spectroscopy.