A method for manufacturing a bonded substrate, the method includes: bonding a first mother substrate including a first substrate and a second mother substrate including a second substrate to form a bonded mother substrate; cutting off a part of the first mother substrate along a dividing line of the bonded mother substrate to form a cutoff portion; dividing the bonded mother substrate along the dividing line; separating a bonded substrate from the bonded mother substrate, the bonded substrate including the first substrate and the second substrate bonded to the first substrate; forming a contact terminal on an end portion of the first mother substrate, the contact terminal contactable with an external terminal; forming a communication path between the first mother substrate and the second mother substrate along the dividing line.

Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing.

A method for manufacturing a liquid discharge head comprising: a substrate, a protective layer covering at least a part of the substrate, and a laminate member formed on the protective layer, wherein the method comprises steps of: forming the protective layer on at least a part of the substrate; forming the laminate member on the protective layer with a part of the protective layer exposed, the protective layer comprises at least Si and C, a content of oxygen in a bulk of the protective layer is less than 20 atomic % in terms of an element composition ratio, a modified layer with a content of oxygen of 20 atomic % or more in terms of an element composition ratio is present on a surface of the protective layer, and a thickness of the modified layer between the protective layer and the laminate member is 3.40 nm or less.

A liquid ejection head comprises: a first print element substrate having an ejection port for ejecting a liquid; a support member supporting the first print element substrate; and an adhesive agent provided for adhering the first print element substrate to the support member, wherein the first print element substrate includes a supply port opposed to the support member and communicating with the ejection port, a first surface opposed to the support member and surrounding the supply port, and a second surface opposed to the support member and provided along at least a part of an outer edge of the first surface and retracted from the first surface relative to the support member, and the adhesive agent is filled in a first space between the first surface and the support member, and at least a part of a second space between the second surface and the support member.

A head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of ensuring the tolerance of the displacement between nozzle holes and communication holes while ensuring the bonding area between an actuator plate and an intermediate plate are provided. The head chip according to an aspect of the present disclosure includes an actuator plate, a nozzle plate disposed so as to be opposed to the actuator plate, and an intermediate plate disposed between the actuator plate and the nozzle plate. The communication holes each include a groove part having a lower-side opening part opening toward the nozzle hole, and a penetrating part having an upper-side opening part opening toward an ejection channel. A dimension in the X direction in the upper-side opening part is larger than a dimension in the X direction in the upper-side opening part, and a dimension in the X direction in the upper-side opening part is no larger than a dimension in the X direction of the channel opening part opening on a channel opening surface of the ejection channel.

There are provided a head chip, a liquid jet head, a liquid jet recording device, and a method of manufacturing a head chip each capable of homogenously forming protective films on inner surfaces of channels while dealing with miniaturization of the channels and a decrease in pitch of the channels. The head chip according to an aspect of the present disclosure includes an actuator plate having a plurality of ejection channels arranged, a common electrode formed on an inner surface of the ejection channel, a first protective film disposed so as to cover the common electrode on the inner surface of the ejection channel, an intermediate plate which has ejecting communication holes and ejection-side introduction ports respectively communicated with the plurality of ejection channels, and which is disposed so as to face a channel opening surface on which the ejection channels open in the actuator plate, and a nozzle plate which has a plurality of nozzle holes configured to eject ink, and which is disposed at an opposite side to the actuator plate with respect to the intermediate plate in a state in which the ejecting communication holes are respectively communicated with the nozzle holes, and the ejection-side introduction ports are closed.

A liquid ejection head of the present invention has: an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the ejection port, and a plurality of wiring pads lined up in a predetermined direction; a flexible wiring substrate having a plurality of leads lined up in the predetermined direction and overlaid on and connected to the plurality of wiring pads respectively, and a base film overlaid on the plurality of leads; and a sealant that seals a plurality of connection portions of the plurality of wiring pads and the plurality of leads. The base film has a plurality of covering portions that respectively cover an opposite side of the plurality of leads from the plurality of connection portions, and an opening or slit formed between the plurality of covering portions.

A liquid ejecting head includes a pressure chamber substrate in which wall surface portions of a pressure chamber are formed, an diaphragm that forms a top surface portion of the pressure chamber, a piezoelectric element that is provided on the diaphragm, and a communication plate, in which an upper surface of the communication plate is bonded to a lower surface of the pressure chamber substrate by an adhesive, the upper surface of the communication plate is provided with a supply opening and a discharge opening, the pressure chamber is longitudinal in an X direction, acute angle portions are formed by the wall surface portions that mutually form an acute angle at each end in the X direction of a bottom surface portion of the pressure chamber, and the acute angle portions do not overlap with the supply opening and the discharge opening in a laminating direction.

Process for manufacturing a microfluidic device, wherein a sacrificial layer is formed on a semiconductor substrate; a carrying layer is formed on the sacrificial layer; the carrying layer is selectively removed to form at least one release opening extending through the carrying layer; a permeable layer of a permeable semiconductor material is formed in the at least one release opening; the sacrificial layer is selectively removed through the permeable layer to form a fluidic chamber; the at least one release opening is filled with non-permeable semiconductor filling material, forming a monolithic body having a membrane region; an actuator element is formed on the membrane region and a cap element is attached to the monolithic body and surrounds the actuator element.