A method for manufacturing a bonded substrate, the method includes: bonding a first mother substrate including a first substrate and a second mother substrate including a second substrate to form a bonded mother substrate; cutting off a part of the first mother substrate along a dividing line of the bonded mother substrate to form a cutoff portion; dividing the bonded mother substrate along the dividing line; separating a bonded substrate from the bonded mother substrate, the bonded substrate including the first substrate and the second substrate bonded to the first substrate; forming a contact terminal on an end portion of the first mother substrate, the contact terminal contactable with an external terminal; forming a communication path between the first mother substrate and the second mother substrate along the dividing line.

A piezoelectric actuator is disclosed that may include a insulating layer, individual electrodes, a common electrode, and a piezoelectric layer. The common electrode may include divisional electrodes that are connected with one another. The individual electrodes may be disposed between the insulating layer and the piezoelectric layer while the piezoelectric layer may be disposed between the individual electrodes and the common electrode. Further, the divisional electrodes may be configured to face the individual electrodes.

An actuator includes a deformable thin-film member having an opening, an electromechanical conversion element disposed at a periphery of the opening of the deformable thin-film member, an insulating film covering the electromechanical conversion element, a protective film over a surface of the insulating film, the protective film covering the surface of the insulating film and a surface of an electrode wiring connected to the electromechanical conversion element, and an adhesion improving film disposed between the electrode wiring and the protective film.

In order to provide an inkjet head using an adhesive containing an epoxy resin as a main agent and an imidazole-based curing agent as a curing agent, capable of securing a time for joining work before curing, and having excellent long-term reliability, and a production method for the inkjet head, constituent members are bonded to each other by an adhesive containing at least an epoxy resin as a main agent, a microencapsulated imidazole-based curing agent as a curing agent, and an alcohol that dissolves the microcapsules at a low temperature, and preferably, a residue of the microcapsules dissolved by the alcohol is dispersed in the cured epoxy resin.

A substrate with an electrical connection section or a substrate for liquid ejection head comprises a wiring layer, a diffusion prevention layer laid on the wiring layer and a connection member laid on the diffusion prevention layer for establishing an electrical connection to an outside. An insulation layer having a wiring-layer-exposing opening is arranged on the wiring layer and the diffusion prevention layer is arranged in the opening, while the connection member is arranged on the diffusion prevention layer so as to cover an outer peripheral edge of the diffusion prevention layer.

A liquid ejection head of the present invention has: an element substrate in which a liquid ejection port is formed, the element substrate having an energy generating element that generates energy for ejecting the liquid from the ejection port, and a plurality of wiring pads lined up in a predetermined direction; a flexible wiring substrate having a plurality of leads lined up in the predetermined direction and overlaid on and connected to the plurality of wiring pads respectively, and a base film overlaid on the plurality of leads; and a sealant that seals a plurality of connection portions of the plurality of wiring pads and the plurality of leads. The base film has a plurality of covering portions that respectively cover an opposite side of the plurality of leads from the plurality of connection portions, and an opening or slit formed between the plurality of covering portions.

Breakage of components is suppressed at the time of bonding. A print head with a metal film formed on laminated layers includes an electric wiring layer electrical connection with a metal film, a protective film covering and protecting the electric wiring layer, a groove separating the protective film and the electric wiring layer around the metal film, and a resin film applied to the groove.

There is provided an MEMS device in which a first substrate provided with a driving element and a second substrate protecting the driving element are bonded to each other with an adhesive, in which the driving element is formed inside the space surrounded by the adhesive between the first substrate and the second substrate, an open hole which communicates with the space and the outside of the adhesive is formed on the adhesive, and an end of the outside of the open hole is provided to be with an end of the first substrate and an end of the second substrate.

A flow passage forming member includes flow passage forming member main bodies 140 and 146 that are formed of a resin material and define at least a part of a flow passage, a metal protective film 200 that is provided on a surface of the flow passage forming member main body 140 and a surface of the flow passage forming member main body 146 defining at least the flow passage and is formed of a metal material, and a protective film 210 that is laminated on the metal protective film 200 and contains an oxide or a nitride of at least on element selected from the group consisting of tantalum (Ta), titanium (Ti), zirconium (Zr), niobium (bib), vanadium (V), hafnium (Hf), silicon (Si), aluminum (Al), tungsten (W), and yttrium (Y).

A method of bonding two components includes plating a first of the components with a first silver layer, a tin layer, and a second silver layer, plating a second of the components with silver, inserting the first and second components into a pre-heated press, and applying pressure to the components causing the components to bond. A stack of layers has a first component layer, a first silver layer, a tin layer, a second silver layer, a second component silver layer, and a second component layer.