A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

A print device includes a head unit holding a heat sink, a head holding member holding the head unit, a platen roller, a support shaft supporting the head holding member to pivot between a close position and a separated position, an urging member, and an adjustment mechanism including an adjustment shaft and an eccentric cam. The separated position is a position where the print head is separated from the platen roller than the close position. The urging member urges the head unit and applies a pressing load pressing the print head against the platen roller. The eccentric cam rotates around the adjustment shaft and coming into contact with the head holding member in a state of being offset with respect to the adjustment shaft. The adjustment mechanism adjusts a position of heating elements of the heat sink with respect to the platen roller by rotating of the eccentric cam.

A printer includes a thermal head, an electrical connector capable of being connected to and disconnected from the thermal head, and a head cover of the thermal head. The head cover moves between a first position and a second position different from the first position to connect and disconnect the thermal head and the electrical connector.

A thermal print head includes a head substrate (11) having a main surface (11a) on which a convex part (12) is formed, a resistor layer (21) that is formed on the main surface (11a) and the convex part (12), a wiring layer (22) that covers the resistor layer (21) such that the resistor layer (21) is exposed at a heat generating part (20) formed at a part of the convex part (12), and a protective layer (25) that is formed on the main surface (11a) of the head substrate (11) and covers the resistor layer (21) and the wiring layer (22). The resistor layer (21) has a main resistor layer that contains tantalum, and at least one of a first sub-resistor layer that contains tantalum nitride and is stacked below the tantalum layer and a second sub-resistor layer that contains tantalum nitride and is stacked on the tantalum layer. The nitrogen content of tantalum nitride contained in the first sub-resistor layer and the second sub-resistor layer exceeds a predetermined value such that the tantalum nitride is deposited in a stable structure.

A thermal head includes a substrate, an electrode, a bonding material, an electrically conductive member, and a sealing material. The electrode is located on the substrate. The bonding material is located on the substrate or the electrode. The electrically conductive member is located on the bonding material and is electrically connected to the electrode via the bonding material. The sealing material is located on the substrate and covers the bonding material and the electrically conductive member. The bonding material includes a protruding portion located at an outer circumferential edge of the electrically conductive member away from the substrate and the electrically conductive member.

A thermal head includes a substrate, a bonding material, an electrically conductive member, and a gold electrode. The bonding material is located on the substrate and contains gold and tin. The electrically conductive member is located on the bonding material. The gold electrode is located on the substrate and electrically connected to the bonding material.

The present disclosure provides a thermal print head. The thermal print head includes a substrate, having a main surface facing one side in a thickness direction; a resistor layer, including a plurality of heat generating portions arranged in a main scanning direction and supported by the substrate; and a wiring layer, forming a power path to the plurality of heat generating portions and supported by the substrate. The substrate includes a convex portion protruding from the main surface and extending along the main scanning direction. The convex portion includes: a flat first surface on which each of the plurality of heat generating portions is disposed; and a first curved convex surface connected to the first surface.

An image forming apparatus includes: a thermal head including a plurality of heating elements; and a controller configured to execute a first one-line printing process to perform printing for one line. The first one-line printing process includes: dividing selected R heating elements into M blocks consisting of a 1-st block to an M-th block such that the M blocks include at least one high current block consisting of p heating elements and at least one low current block consisting of q heating elements; and energizing the M blocks at different timings. In a case where the 1-st block is the high current block, at least one block of the M blocks excluding the M-th block is the low current block. In a case where the 1-st block is the low current block, at least one block of the M blocks excluding the M-th block is the high current block.

The present disclosure provides a thermal print head for achieving fine printing. A thermal print head of the disclosure includes: a substrate, having a substrate main surface and a substrate back surface facing opposite sides in a z direction; a resistor layer, disposed on a side of the substrate main surface and including a plurality of heat generating portions arranged in a main scan direction to generate heat by energization; a wiring layer, disposed on the side of the substrate main surface and including a conduction path for electrically conducting the plurality of heat generating portions; a metal layer, interposed between the substrate and the wiring layer with the resistor layer; and an insulating layer, interposed between the metal layer and the wiring layer with the resistor layer. The conduction path includes the metal layer. The metal layer includes tantalum (Ta).

An apparatus is configured to heat a print medium in which a plurality of color development layers that develop colors in accordance with heating are stacked in correspondence with a plurality of colors so as to form an image on the medium by causing a desired color development layer in the plurality of color development layers to independently develop the color. The apparatus includes a printhead, an input unit configured to receive a print job, a generation unit configured to generate image data and cut information for specifying a cut position, a second generation unit configured to generate first and second pulses for driving the print head, and a drive unit configured to drive the print head to form an image on the medium and apply heat beyond a melting point to melt the medium so as to cut the medium.