A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

The present disclosure provides a thermal print head. The thermal print head includes a substrate having a main surface and a convex portion and including a semiconductor material; a resistor layer including a plurality of heat generating portions located on the convex portion; and a wiring layer conducted to the plurality of heat generating portions and formed to contact the resistor layer. The convex portion has a top surface, a first inclined surface and a second inclined surface. The first inclined surface and the second inclined surface are disposed between the main surface and the top surface, separated from each other in a sub-scanning direction, and tilted with respect to the main surface. A first tilted angle of the first inclined surface with respect to the main surface and a second tilted angle of the second inclined surface with respect to the main surface are greater than 55 degrees.

A thermal print head includes a head substrate (11) having a main surface (11a) on which a convex part (12) is formed, a resistor layer (21) that is formed on the main surface (11a) and the convex part (12), a wiring layer (22) that covers the resistor layer (21) such that the resistor layer (21) is exposed at a heat generating part (20) formed at a part of the convex part (12), and a protective layer (25) that is formed on the main surface (11a) of the head substrate (11) and covers the resistor layer (21) and the wiring layer (22). The resistor layer (21) has a main resistor layer that contains tantalum, and at least one of a first sub-resistor layer that contains tantalum nitride and is stacked below the tantalum layer and a second sub-resistor layer that contains tantalum nitride and is stacked on the tantalum layer. The nitrogen content of tantalum nitride contained in the first sub-resistor layer and the second sub-resistor layer exceeds a predetermined value such that the tantalum nitride is deposited in a stable structure.

A thermal head includes a substrate, an electrode, a bonding material, an electrically conductive member, and a sealing material. The electrode is located on the substrate. The bonding material is located on the substrate or the electrode. The electrically conductive member is located on the bonding material and is electrically connected to the electrode via the bonding material. The sealing material is located on the substrate and covers the bonding material and the electrically conductive member. The bonding material includes a protruding portion located at an outer circumferential edge of the electrically conductive member away from the substrate and the electrically conductive member.

A thermal head includes a substrate, a bonding material, an electrically conductive member, and a gold electrode. The bonding material is located on the substrate and contains gold and tin. The electrically conductive member is located on the bonding material. The gold electrode is located on the substrate and electrically connected to the bonding material.

The present disclosure provides a thermal print head and a method manufacturing the thermal print head, and a thermal printer including the thermal print head. The thermal print head includes: a substrate having a protruding surface; a resistance layer including multiple heating portions and a portion formed on the protruding surface; and a wiring layer conductive to the multiple heating portions. The thermal print head further includes a glaze layer having a pair of end edges arranged apart from each other in y direction and formed in contact with a top surface of the protruding surface. The multiple heating portions are formed on the glaze layer. When observed in z direction, each of the pair of end edges includes a receding section located closer to an inner side of the top surface than a junction of the top surface, and a pair of inclined surfaces of the protruding surface.

A thermal head includes a substrate, an electrode, and a gap. The electrode is located on the substrate. The gap is located between the substrate and the electrode. The thermal head contains glass in an inner portion of the gap.

The present disclosure provides a method for manufacturing a thermal print head. The method includes: forming an electrode layer on a substrate; and forming a resistor layer including a plurality of heat generating portions connected to the electrode layer. The electrode layer includes a plurality of individual electrodes including a plurality of first striped portions extending in a secondary scan direction and spaced apart in a main scan direction, and a common electrode including a plurality of second striped portions extending in the secondary scan direction. The forming of the resistor layer includes: a coating process of applying a resistor paste in a stripe that overlaps the first striped portions and the second striped portions; a firing process of firing the resistor paste to form a resistor film; and a removal process of removing a removal region in the resistor paste or the resistor film.

A thermal print head includes a substrate, a resistor layer and a wiring layer. The substrate is made of a single crystal semiconductor and includes an obverse surface facing in one sense of a thickness direction. The resistive layer is supported by the substrate and includes a plurality of heat generating parts arranged side by side in a main scanning direction. The wiring layer is supported by the substrate and forms a conductive path to the plurality of heat generating parts. The wiring layer includes a conductive part and a heat generating sub-part for each of the plurality of heat generating parts, where the conductive part has a lower resistance value per unit length in a sub-scanning direction than the heat generating part, and where the heat generating sub-part has a resistance value per unit length in the sub-scanning direction that falls between the respective resistance values of the heat generating part and the conductive part. The substrate includes a ridge raised from the obverse surface and extending in the main scanning direction. The heat generating part, the heat generating sub-part and the conductive part are disposed on the ridge. The heat generating sub-part is located between the heat generating part and the conductive part in the sub-scanning direction.

A thermal head includes a substrate, a heat-generating portion disposed on the substrate, electrodes disposed on the substrate and electrically connected to the heat-generating portion, a driver IC disposed on the substrate and electrically connected to the electrodes, and a covering member covering the driver IC. In plan view, a center line of the driver IC extending in a main scanning direction and a highest position of the covering member are located farther form the heat-generating portion than a center line of the covering member extending in the main scanning direction.