A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.

A thermal print head includes a head substrate (11) having a main surface (11a) on which a convex part (12) is formed, a resistor layer (21) that is formed on the main surface (11a) and the convex part (12), a wiring layer (22) that covers the resistor layer (21) such that the resistor layer (21) is exposed at a heat generating part (20) formed at a part of the convex part (12), and a protective layer (25) that is formed on the main surface (11a) of the head substrate (11) and covers the resistor layer (21) and the wiring layer (22). The resistor layer (21) has a main resistor layer that contains tantalum, and at least one of a first sub-resistor layer that contains tantalum nitride and is stacked below the tantalum layer and a second sub-resistor layer that contains tantalum nitride and is stacked on the tantalum layer. The nitrogen content of tantalum nitride contained in the first sub-resistor layer and the second sub-resistor layer exceeds a predetermined value such that the tantalum nitride is deposited in a stable structure.

The present disclosure provides a thermal print head and a method of fabricating the thermal print head. The thermal print head includes a substrate made of a semiconductor material and having a main surface and a convex portion, a resistor layer including a plurality of heat generating portions on the convex portion, and a wiring layer conducted to the plurality of heat generating portions and formed to contact the resistor layer. The convex portion has a top surface, a first inclined surface and a second inclined surface. At least one of two ends of the convex portion in the main scanning direction forms a third inclined surface connected to the main surface and the first inclined surface, and a fourth inclined surface connected to the main surface and the second inclined surface.

A thermal head includes a substrate, an electrode, a bonding material, an electrically conductive member, and a sealing material. The electrode is located on the substrate. The bonding material is located on the substrate or the electrode. The electrically conductive member is located on the bonding material and is electrically connected to the electrode via the bonding material. The sealing material is located on the substrate and covers the bonding material and the electrically conductive member. The bonding material includes a protruding portion located at an outer circumferential edge of the electrically conductive member away from the substrate and the electrically conductive member.

A thermal head includes a substrate, a bonding material, an electrically conductive member, and a gold electrode. The bonding material is located on the substrate and contains gold and tin. The electrically conductive member is located on the bonding material. The gold electrode is located on the substrate and electrically connected to the bonding material.

A thermal head includes a substrate, an electrode, and a gap. The electrode is located on the substrate. The gap is located between the substrate and the electrode. The thermal head contains glass in an inner portion of the gap.

A thermal print head includes a substrate, a resistor layer and a wiring layer. The substrate is made of a single crystal semiconductor and includes an obverse surface facing in one sense of a thickness direction. The resistive layer is supported by the substrate and includes a plurality of heat generating parts arranged side by side in a main scanning direction. The wiring layer is supported by the substrate and forms a conductive path to the plurality of heat generating parts. The wiring layer includes a conductive part and a heat generating sub-part for each of the plurality of heat generating parts, where the conductive part has a lower resistance value per unit length in a sub-scanning direction than the heat generating part, and where the heat generating sub-part has a resistance value per unit length in the sub-scanning direction that falls between the respective resistance values of the heat generating part and the conductive part. The substrate includes a ridge raised from the obverse surface and extending in the main scanning direction. The heat generating part, the heat generating sub-part and the conductive part are disposed on the ridge. The heat generating sub-part is located between the heat generating part and the conductive part in the sub-scanning direction.

A thermal head includes a substrate, a heat-generating portion disposed on the substrate, electrodes disposed on the substrate and electrically connected to the heat-generating portion, a driver IC disposed on the substrate and electrically connected to the electrodes, and a covering member covering the driver IC. In plan view, a center line of the driver IC extending in a main scanning direction and a highest position of the covering member are located farther form the heat-generating portion than a center line of the covering member extending in the main scanning direction.

Provided is a thermal print head including: a substrate having a convex part thereon; a wiring layer over the convex part; a heat storage layer over the wiring layer; a heating resistive part that is formed over the heat storage layer and is arranged along a main scanning direction; a first electrode in contact with the heating resistive part on one side in a sub-scanning direction; a second electrode in contact with the heating resistive part on another side in the sub-scanning direction; and a connection wiring formed in an opening that passes through the heating resistive part and the heat storage layer and reaches the wiring layer, in which the first electrode is electrically connected to the wiring layer via the connection wiring.

A thermal head of the present disclosure includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. A skewness Rsk of the protective layer is larger than 0. Further, A thermal head of the present disclosure includes a substrate, a heat-generating portion, electrodes, and a protective layer. The heat-generating portion is located on the substrate. The electrodes are located on the substrate and are connected to the heat-generating portion. The protective layer covers the heat-generating portion and parts of the electrodes. A kurtosis Rku of the protective layer is larger than 3.