A memory cell includes an input coupled to a read line, an output coupled to a circuit ground, a bi-polar memristor, and at least one address switch coupled to an address line to select the memory cell. A memory includes the bi-polar memristor and a one-way current conducting device, wherein the one-way current conducting device is positioned between the memristor cell output and the circuit ground, or between the read line and the memristor cell input.

A liquid ejecting apparatus includes a drive element, and a drive circuit that outputs a drive signal that drives the drive element, wherein the drive circuit includes a modulation circuit that modulates a base drive signal to output a modulation signal, an amplifier circuit that amplifies the modulation signal to output an amplified modulation signal, a demodulation circuit that demodulates the amplified modulation signal to output the drive signal, and a substrate on which the modulation circuit, the amplifier circuit, and the demodulation circuit are provided, wherein the substrate includes a base material includes a metal and a first layer laminated on the base material, wherein the first layer includes a first propagation wire through which at least one of the amplified modulation signal and the drive signal propagates, and wherein the base material has a thickness greater than a thickness of the first layer.

A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The plurality of inkjet chips include at least one first inkjet chip and at least one second inkjet chip. The plurality of inkjet chips are directly formed on the chip substrate by the semiconductor process, respectively, and diced into the at least one first inkjet chip and the at least one second inkjet chip, to be implemented for inkjet printing.

The present subject matter relates to disposing memory banks and select register. In an example implementation, a plurality of memory banks is arranged to form a group of memory banks. Each memory bank includes a plurality of memory units. At least one select register generates a select signal to access the memory units in the plurality of memory banks. The at least one select register is disposed at an end of the group of memory banks.

A printer includes a board configured to control a printing unit operating in the printer that performs printing on a medium, and a heat sink including a counter surface that is provided to face a board surface of the board and that has a shape with a length in a first direction X longer than a length in a second direction Y intersecting the first direction X in a plan view, and configured to receive heat generated in the board with the counter surface and dissipate the heat to the outside. The counter surface includes a slit penetrating the counter surface and extending in the second direction Y.

A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

A heating device is provided. The heating device includes a substrate, a thin-film transistor disposed on the substrate, a heater disposed on the substrate, and a bridging component. The thin-film transistor includes a gate, a semiconductor layer, a source, and a drain. The bridging component is electrically connected to the heater and either the source or the drain. A method for fabricating the heating device is also provided.

A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.

An integrated circuit to drive a plurality of fluid actuation devices includes a fire line, a plurality of memory elements, a first switch, and a plurality of second switches. The first switch is electrically coupled between the fire line and a first side of each memory element of the plurality of memory elements. Each second switch is electrically coupled to a second side of a respective memory element of the plurality of memory elements.

A liquid discharge head includes a nozzle member. The nozzle member includes a nozzle, a deformable laminar member, and an electromechanical transducer. The nozzle discharges liquid. The deformable laminar member has an opening forming the nozzle. The electromechanical transducer is disposed around the opening. The nozzle member is warped with respect to a discharge-side plane of the nozzle member in a surrounding area of the nozzle when no voltage is applied to the electromechanical transducer.