Patent classifications
B41J2202/19
Liquid ejecting head, head unit, and liquid ejecting apparatus
A liquid ejecting head includes a first sidewall, a second sidewall, and head chips. The head chips are arranged side by side between the first sidewall and the second sidewall. Each of the head chips has nozzles configured to discharge a liquid. The first sidewall is formed by a portion of a holder from which the liquid is to be supplied to the head chips, whereas the second sidewall is formed by a portion of a fixed plate to which the head chips are fixed. The fixed plate has an aperture through which the nozzles are exposed.
Liquid ejecting head and liquid ejecting apparatus
A liquid ejecting head includes wiring members including a first-wiring member having a first-output terminal portion extending in a first-direction and a first-input terminal portion extending in the first-direction, and a second-wiring member having a second-output terminal portion extending in the first-direction and a second-input terminal portion extending in the first-direction; and a first-wiring substrate coupled to the first and second input terminal portions, in which a center of the first-output terminal portion is located in the first-direction with respect to a center of the second-output terminal portion in plan view, a center of the first-input terminal portion is disposed in a second-direction opposite to the first-direction with respect to the center of the first-output terminal portion in the plan view, and a center of the second-input terminal portion is disposed in the first-direction with respect to the center of the second-output terminal portion in the plan view.
LIQUID EJECTION APPARATUS AND CONTROL METHOD
An aspect of the present disclosure is a liquid ejection apparatus including: a liquid ejection head including a conversion element that generates energy required to eject liquid, a first protection layer that blocks contact between the conversion element and the liquid, a second protection layer that partially covers the first protection layer and functions as a first electrode, a second electrode that is electrically connected to the first electrode through the liquid, and an ejection port that ejects the liquid, and a control unit configured to control a potential difference between the first electrode and the second electrode in printing to a predetermined value by changing at least one of potentials of the first electrode and the second electrode. The control unit sets the potential difference based on at least one of a condition and a configuration of the liquid ejection head.
INKJET PRINTHEAD ASSEMBLY HAVING PRINTHEAD CHIP CARRIERS RECEIVED IN SLOT
A printhead is provided having an elongate support having a plurality of internal webs protruding from a base section to define a plurality of parallel fluid supply channels, a shim supported by the support and defining a plurality of rows of openings through which fluid from respective supply channels is supplied, and a plurality of elongate printhead modules supported serially on the shim. Each module defines a plurality of fluid supply passages through which fluid passes to fluid ejection nozzles from respective rows of the openings. Either end of each module defines complementary formations such that adjacent modules nest together.
FLOW PATH STRUCTURE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, AND MANUFACTURING METHOD OF FLOW PATH STRUCTURE
A flow path structure which forms a flow path of liquid, includes: a light absorbing member (first substrate) having absorbing properties with respect to laser light; a light transmitting member (second substrate) which is joined to the light absorbing member and has transmitting properties with respect to the laser light; a first flow path (flow path) which is surrounded by a welding interface between the light absorbing member and the light transmitting member; and a second flow path which is formed in a flow path pipe (flow path pipe) which protrudes from a front surface opposite of the welding interface in the light transmitting member, and communicates with the first flow path, in which the flow path pipe is included in a region of the first flow path in a plan view from a direction orthogonal to the welding interface.
INK JET APPARATUS
An ink jet apparatus includes a head, a circuit substrate, a cover frame, a heat sink, a fan, and a wall section. The cover frame supports the circuit substrate that has a drive circuit that drives the head inside of the cover frame and has a through hole. The heat sink that dissipates heat generated in the circuit substrate is disposed inside of the cover frame and has a part that is in direct or indirect contact with the circuit substrate. The fan generates air flow and is arranged such that the fan and the heat sink face to each other via the through hole. The wall section is disposed inside of the cover frame such that the air flow is not directly blown against the drive circuit and the air flow having changed a direction after blown against the heat sink is not blown against the drive circuit.
LIQUID DISCHARGE HEAD ATTACHMENT DEVICE, LIQUID DISCHARGE UNIT, AND LIQUID DISCHARGE APPARATUS
A liquid discharge head attachment device includes a liquid discharge head including a plurality of nozzles that discharges liquid. The liquid discharge head has a nozzle face mounting the nozzles and a side face being perpendicular to the nozzle face. An attachment member is attached with the liquid discharge head. A position adjuster contacts the side face of the liquid discharge head and adjusts a position of the liquid discharge head with respect to the attachment member. The position adjuster is disposed outboard from the nozzles of the liquid discharge head. The position adjuster overlaps the liquid discharge head in an orthogonal direction perpendicular to the nozzle face of the liquid discharge head in at least a part of the position adjuster.
Inkjet printhead having robust encapsulation of wirebonds
An electronic assembly includes a substrate having a die and PCB mounted thereon. Wirebonds interconnect bond pads of the die with contact pads of the PCB, each wirebond having a first end portion bonded to a respective bond pad, an opposite second end portion bonded to a respective contact pad and an intermediate section extending between the first and second end portions. A dam encapsulant encapsulates each of the first and second end portions, a first fill encapsulant contacts the substrate and the dam encapsulant; and a second fill encapsulant overlies the first fill encapsulant. The first fill encapsulant has a lower modulus of elasticity than the second fill encapsulant and the dam encapsulant.
Liquid discharge apparatus
The width by which the first, second heads overlap each other cross-sectionally along the first direction is greater than the width by which the fifth, sixth heads overlap each other cross-sectionally along the first direction.
LIQUID EJECTION HEAD
Provided is a liquid ejection head including plural liquid chambers arranged in rows, each liquid chamber being provided with an orifice configured to eject liquid filling the liquid chamber and an ejection energy generating element, wherein the liquid ejection head includes: a liquid supply path that extends in a direction that the plural liquid chambers are arranged and individually communicates with the plural liquid chambers; a direction change flow path that communicates with the liquid supply path and extends in a direction transverse to the liquid supply path; and a common supply flow path that communicates with the direction change flow path and extends in a direction transverse to the direction change flow path, such that the direction change flow path includes a body portion and at least one grooved flow path, which is narrower than the body portion.