An imprint apparatus forms a pattern of an imprint material on a substrate by using a mold. A substrate holding unit holds the substrate by a suction force between the substrate and a holding surface and includes a first suction unit for sucking a rear surface of a first region of the substrate with a first suction force and a second suction unit for sucking a rear surface of a second region of the substrate with a second suction force. A deformation mechanism deforms a shape of the first region in a direction along the holding surface when forming the pattern of the imprint material on the first region. An adjusting unit adjusts the first and second suction forces. The first suction force is less than the second in at least a portion of a period during the deforming of the shape of the first region by the deformation mechanism.

A method for operating a web printing press is provided. The method includes unwinding a substrate from a roll to define a web; during makeready, printing the web using at least one print unit, the makeready ending when the web is being printed to a desired standard; stopping the web after the makeready; rewinding the web so that the substrate printed during the make ready pass back through the print unit; and unwinding again the rewound substrate to pass through the print unit. A press and printed product are also provided.

A method for operating a web printing press is provided. The method includes unwinding a substrate from a roll to define a web; during makeready, printing the web using at least one print unit, the makeready ending when the web is being printed to a desired standard; stopping the web after the makeready; rewinding the web so that the substrate printed during the make ready pass back through the print unit; and unwinding again the rewound substrate to pass through the print unit. A press and printed product are also provided.

An imprint method of forming a pattern of a resin on a substrate held on a holding surface. An uncured resin on the substrate is brought in contact with a mold. A partial region of the substrate is thermally deformed by irradiating the region with light so as to change an outer circumferential shape of the region. The uncured resin is cured on the region by irradiating light having a wavelength different from the deforming light. The mold is released from the cured resin on the region in contact with the mold. In at least a portion of a period during the deforming step, a region different from the region is held at a first suction force, while the region is held at a second suction force less than the first. The first suction force and the second suction force act between the substrate and the holding surface.