A method of marking an optical fiber that includes directing a laser beam onto a first colored layer of an optical fiber. The optical fiber includes a core and a cladding surrounding the core, the first colored layer surrounds the cladding, and the laser beam modifies the first colored layer to form one or more laser-modified regions along an outer surface of the first colored layer.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

This disclosure is related to arranging micro devices in the donor substrate by either patterning or population so that there is no interfering with non-receiving pads and the non-interfering area in the donor substrate is maximized. This enables the transfer of micro devices to a receiver substrate with fewer steps.

The disclosure concerns method of making an interconnect substrate that may comprise providing a core. The core may comprise a composite core, which may comprise a PCB, a laminate core with build-up layers, or molded core. A first patterned frontside conductive layer may be formed over a front side of the core. A first frontside molded dielectric layer may be disposed over the front side of the core and over the first patterned frontside conductive layer. One or more other dielectric layers (such as polyimide) may be disposed before (and under) the first frontside molded dielectric layer. The core may be flipped such that a back side of the core is presented or configured for processing. A first patterned frontside conductive layer may be formed over the back side of the core.

A selective dyeing method is used for dyeing a substrate, selectively within a first exposed surface portion of said substrate. For this purpose, the substrate consists of a material that is impervious to a dye with the exception of the first portion of the exposed surface. In particular, the impervious material can form a layer which covers a base portion of the substrate in a second portion of the exposed surface. The substrate is heated such that the dye penetrates a pervious material which constitutes the first portion of the exposed surface. The method is particularly useful for eliminating light diffused by the walls of a multilayer structure which is supported by means of ocular glass.

Cable sheathing compositions are provided for use in laser marking methods. Cable sheathing compositions include amounts of laser marking additives and color concentrates to enhance the absorption of laser energy and create an indelible mark. Laser marking methods employ cables formed with sheathing compositions and provide advantages to both the speed and power efficiency required by the laser source, as well as the quality and contrast ratio of the resulting laser mark. Cable manufacturing methods and apparatus employing the laser marking methods are also contemplated.