A heat pen may be used with an electronic cutting and/or drawing system to enable the electronic cutting and/or drawing system to use heat to define text and/or designs on a substrate. The heat pen may be coupled with a cradle of an electronic cutting and/or drawing system directly or by assembling an adapter with the heat pen. Power may be supplied to the heat pen by electrically coupling the heat pen to an external power supply, such as a power and/or communications port of the electronic cutting and/or drawing system. Electronic heated design systems and methods for modifying substrates using heat are also disclosed.

A heat pen may be used with an electronic cutting and/or drawing system to enable the electronic cutting and/or drawing system to use heat to define text and/or designs on a substrate. The heat pen may be coupled with a cradle of an electronic cutting and/or drawing system directly or by assembling an adapter with the heat pen. Power may be supplied to the heat pen by electrically coupling the heat pen to an external power supply, such as a power and/or communications port of the electronic cutting and/or drawing system. Electronic heated design systems and methods for modifying substrates using heat are also disclosed.

A heat pen may be used with an electronic cutting and/or drawing system to enable the electronic cutting and/or drawing system to use heat to define text and/or designs on a substrate. The heat pen may be coupled with a cradle of an electronic cutting and/or drawing system directly or by assembling an adapter with the heat pen. Power may be supplied to the heat pen by electrically coupling the heat pen to an external power supply, such as a power and/or communications port of the electronic cutting and/or drawing system. Electronic heated design systems and methods for modifying substrates using heat are also disclosed.

A heat pen may be used with an electronic cutting and/or drawing system to enable the electronic cutting and/or drawing system to use heat to define text and/or designs on a substrate. The heat pen may be coupled with a cradle of an electronic cutting and/or drawing system directly or by assembling an adapter with the heat pen. Power may be supplied to the heat pen by electrically coupling the heat pen to an external power supply, such as a power and/or communications port of the electronic cutting and/or drawing system. Electronic heated design systems and methods for modifying substrates using heat are also disclosed.

The present disclosure is directed to a high volume branding system for branding baked goods with a desired indicia. The system includes a branding conveyor for receiving the baked goods in the pans and conveying the pans downstream. The system also includes a branding station positioned above the branding conveyor. The branding station includes a shuttle that is provided with a branding press. The shuttle is configured to travel downstream with the branding conveyor in a first direction and upstream in a second direction. The shuttle is configured to align a branding press with at least one of the pans on the branding conveyor while the pan is moving downstream with the branding conveyor. The branding press includes a branding plate that is heated and lowered with the branding press onto the baked goods in the pan while the shuttle is moving downstream along with the pan and branding conveyor to brand indicia onto the baked goods. When the indicia is branded onto the baked goods, the branding press and branding plate are raised and the shuttle is moved in the second direction to align the branding press with another one of the pans on the branding conveyor.