The present invention refers to a device for packaging visual communication boards and to the respective packaging method, characterized by a set of at least nine sections that comprises feeding the boards (1); fitting the lateral and upper profiles (2), cleaning of the boards (3); placing of the boards in the packaging material (4) and the positioning of the packaging material, the distribution of the bonding product on the surface of the packaging material and the placing of tops on the packaging material (5); executing the bonding of the referred tops on the packaging material; folding the packaging material and package seal (6); sealing the packaging material (7), labelling the package (8); control and wrapping (9) or palletization of the final product.

The present invention refers to a device for packaging visual communication boards and to the respective packaging method, characterized by a set of at least nine sections that comprises feeding the boards (1); fitting the lateral and upper profiles (2), cleaning of the boards (3); placing of the boards in the packaging material (4) and the positioning of the packaging material, the distribution of the bonding product on the surface of the packaging material and the placing of tops on the packaging material (5); executing the bonding of the referred tops on the packaging material; folding the packaging material and package seal (6); sealing the packaging material (7), labelling the package (8); control and wrapping (9) or palletization of the final product.

A method for realising a package that comprises the following steps: arranging a first longitudinal edge (2) of the package in a substantially horizontal position; stacking a predefined number of ceramic tiles (T) to form a pile (P) on the 5 first longitudinal edge (2); arranging a second longitudinal edge (3) of the package on the pile (P); associating a bottom (4) of the package with a first longitudinal side of the first and of the second longitudinal edge (2,3); associating a first transversal edge (5) of the package with a first 10 transversal side of the first and of the second longitudinal edge (2,3); associating a second transversal edge (6) of the package with a second transversal side of the first and of the second longitudinal edge (2,3); rotating the package resting on the bottom (4).

A method for realising a package that comprises the following steps: arranging a first longitudinal edge (2) of the package in a substantially horizontal position; stacking a predefined number of ceramic tiles (T) to form a pile (P) on the 5 first longitudinal edge (2); arranging a second longitudinal edge (3) of the package on the pile (P); associating a bottom (4) of the package with a first longitudinal side of the first and of the second longitudinal edge (2,3); associating a first transversal edge (5) of the package with a first 10 transversal side of the first and of the second longitudinal edge (2,3); associating a second transversal edge (6) of the package with a second transversal side of the first and of the second longitudinal edge (2,3); rotating the package resting on the bottom (4).

Described herein is a packaging system comprising a sleeve having a plurality of sides, an open top, and an open bottom, each of the sides having an inner surface, an inner liner located on the inner surfaces of the sides of the sleeve, the inner liner having an inner surface that defines a cavity, a plurality of building panels located in the cavity, and an outer wrapping surrounding at least a portion of the sleeve and at least a portion of the plurality of building panels.

Described herein is a packaging system comprising a sleeve having a plurality of sides, an open top, and an open bottom, each of the sides having an inner surface, an inner liner located on the inner surfaces of the sides of the sleeve, the inner liner having an inner surface that defines a cavity, a plurality of building panels located in the cavity, and an outer wrapping surrounding at least a portion of the sleeve and at least a portion of the plurality of building panels.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.

A shipping system for shipping planar substrates includes a plurality of planar substrates stacked to form a pack and a plurality of interleaving material including substantially spherical beads positioned between the substrates of the pack and configured to carry a load. Substantially all of the beads have a diameter within 25% of D.sub.max, where D.sub.max is a diameter corresponding to a size of an opening of an upper limit sieve used in the shipping system. Also disclosed are a spacer for use in a shipping system for shipping planar substrates, a wrapped system for shipping planar substrates, a method of wrapping a system for shipping planar substrates, and a powder applicator.