To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.

To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.

The present invention relates to a wire coating apparatus capable of evenly coating an insulating thin film on the surface of a wire such as a bonding wire having a small diameter, and the wire insulating thin film coating apparatus according to the present invention comprises: a coating portion which coats the surface of the wire with the insulating thin film while being blocked from the outside; and a wire process setting portion which is installed to be movable to the inside and outside of the coating portion and on which the wire is wound while the inside and outside of the wire are exposed so that a coating process of the insulating thin film is performed in the coating portion.

A wire supply module may include a plurality of spools and a joint machine. Wires may be wound on the spools. The joint machine may be arranged between the spools to join the wires to each other. The joint machine may include a housing, a jointer and a cutter. The housing may have a joint passage configured to receive ends of the wires. The jointer may be arranged in the housing to join the ends of the wires to each other. The cutter may be arranged in the housing to partially cut the joined ends of the wires. Thus, when all the wire on a currently used spool may be exhausted, the wire on another spool may be joined to the wire on the currently used spool so that the wire may be continuously supplied without a spool exchange.

A wire feeder includes a cartridge disposed in a supply position and having a wire spool wound with a wire, and including an outlet portion through which the wire is drawn outwardly along an internal travel path, an air guide disposed on a wire supply path and including a first inlet portion through which the wire drawn out from the outlet portion is drawn in, wherein the first inlet portion is aligned with the outlet portion on the wire supply path, a sensor disposed at the first inlet portion of the air guide, and a first vacuum line generating a vacuum in an interior of the first inlet portion according to a detection of the wire at the first inlet by the sensor.