B81B2203/0346

MEMS MODULE AND METHOD OF MANUFACTURING MEMS MODULE
20230016038 · 2023-01-19 · ·

A MEMS module includes: a first MEMS element and a second MEMS element each including a movable portion which is a portion of a substrate including a hollow portion formed therein, the movable portion configured to warp in shape according to an air pressure difference between an internal air pressure inside the hollow portion and an external air pressure outside the hollow portion; and an electronic component configured to calculate a change in external air pressure outside the substrate by using an amount of warpage of the movable portion of at least one of the first MEMS element and the second MEMS element, wherein the amount of warpage of the movable portion according to the external air pressure differs between the first MEMS element and the second MEMS element.

MICROELECTROMECHANICAL SYSTEM
20220363533 · 2022-11-17 ·

A microelectromechanical system includes a backplate and a diaphragm. The backplate includes spaced stator elements with voids formed therebetween. The stator element includes a first conductive element. The diaphragm includes a plurality of corrugations facing the voids respectively. Each corrugation includes a groove formed at a surface thereof away from the backplate. The corrugation includes a second conductive element. The diaphragm is moveable with respect to the backplate in response to a pressure exerted thereon to cause the corrugations to be moved into or out of the corresponding voids, thereby changing the capacitance formed between the first and second conductive elements. The corrugations are defined by grooves formed at surfaces away from the backplate, which facilitate to control the compliance of the diaphragm and reduce stiffness of the diaphragm. The corrugation can be formed with lower aspect ratios, which allows it to be formed using standard front side processes.

OPTICAL SCANNING DEVICE
20230097867 · 2023-03-30 · ·

An optical scanning device includes a control unit, a light deflector, light detection units, and a light source. A mirror unit of the light deflector has a flat reflection part for generating scanning light and a groove-shaped reflection part for generating twice reflected light, and performs reciprocating rotation about a rotation axis. The light detection units are disposed at positions on the scanning trajectory of the scanning light where the twice reflected light is received, and are each divided into light detectors in the scanning direction of the scanning light by a division line. The control unit detects the deflection angle θ of the mirror unit based on both the output of the light detector and the output of the light detector.

Electrostatic Device, Electrostatic Device Intermediate Body and Production Method
20220324697 · 2022-10-13 ·

An electrostatic device includes: a fixed portion, a moveable portion, and an elastically-supporting portion that are formed in a same substrate; and a first glass package and a second glass package that are anodically bonded to each other on one and the other of front and back surfaces of the substrate with the fixed portion and the elastically-supporting portion separated from each other, the second glass package forms a sealed space in which the moveable portion is arranged between the first and second glass packages, an electret is formed at least partially in the fixed portion and the moveable portion, and a first electrode connected to the fixed portion and exposed on an outer surface of the second glass package and a second electrode connected to the elastically-supporting portion and exposed on the outer surface of the second glass package are formed in the second glass package.

Use of an uncoupling structure for assembling a component having a casing

In an assembly between a MEMS and/or NEMS electromechanical component and a casing, the electromechanical component includes at least one suspended and movable structure which is provided with at least one fixing zone, on which a region for receiving the casing is fixed, the suspended structure being at least partially formed in a cover for protecting the component or in a layer which is different from the one in which a sensitive element of the component is formed.

USE OF AN UNCOUPLING STRUCTURE FOR ASSEMBLING A COMPONENT HAVING A CASING

In an assembly between a MEMS and/or NEMS electromechanical component and a casing, the electromechanical component includes at least one suspended and movable structure which is provided with at least one fixing zone, on which a region for receiving the casing is fixed, the suspended structure being at least partially formed in a cover for protecting the component or in a layer which is different from the one in which a sensitive element of the component is formed.

MEMS DEVICE

The present disclosure provides a MEMS device having a movable portion. The MEMS device includes: a substrate; a recess, disposed in the substrate; the movable portion, hollowly supported in the recess; and a bump stop, hollowly supported in the recess and configured to restrict a movement of the movable portion by contacting the movable portion. The bump stop includes: a protruding portion, configured to contact the movable portion; and a shock absorbing portion, disposed between the protruding portion and the substrate and configured to absorb at least a part of an impact force applied to the protruding portion by elastic deformation.

Method of forming micro-pipes on a substrate and a structure formed thereof

A method for producing a structure including, on a main surface of a substrate, at least one elongated cavity having openings at opposing ends. The method includes providing a substrate having a main surface. On the main surface, a first pair of features are formed that protrude perpendicularly from the main surface. The features have elongated sidewalls and a top surface, are parallel to one another, are separated by a gap having a width s1 and a bottom area, and have a width w1 and a height h1. At least the main surface of the substrate and the first pair of features are brought in contact with a liquid, suitable for making a contact angle of less than 90 with the material of the elongated sidewalls and subsequently the substrate is dried.

PIEZOELECTRIC ACTUATING APPARATUS

A piezoelectric actuating apparatus includes a frame having an opening, a rotatable element, first and second actuating elements, a sensing element, transmission elements, a sensing electrode, and a driving electrode. The rotatable element is in the opening, connected to the frame via a rotating shaft structure, and reciprocatingly swings relative to the frame around an axis of the rotating shaft structure as a center. The first actuating element is connected to the rotatable element. The transmission elements are between the first and second actuating elements, and between the first actuating element and the sensing element. The second actuating element and the sensing element are coupled to the rotatable element via the transmission elements. The sensing electrode is on a part of the transmission elements and the sensing element. The driving electrode is on another part of the transmission elements and the first and second actuating elements.

Method of Forming Micro-pipes on a Substrate and a Structure Formed Thereof

A method for producing a structure including, on a main surface of a substrate, at least one elongated cavity having openings at opposing ends. The method includes providing a substrate having a main surface. On the main surface, a first pair of features are formed that protrude perpendicularly from the main surface. The features have elongated sidewalls and a top surface, are parallel to one another, are separated by a gap having a width s1 and a bottom area, and have a width w1 and a height h1. At least the main surface of the substrate and the first pair of features are brought in contact with a liquid, suitable for making a contact angle of less than 90 with the material of the elongated sidewalls and subsequently the substrate is dried.