A temperature sensor is a temperature sensor using a MEMS resonator, and includes: a MEMS resonator; a sweeper that sweeps a frequency of an excitation signal for a vibrator of the MEMS resonator in a predetermined sweep direction, and outputs the excitation signal swept to the MEMS resonator; a discontinuity point detector that obtains a vibration state information signal, which is a characteristic quantity expressing a vibration state of the vibrator based on the excitation signal, from the MEMS resonator, and detects a detection value that is (i) a frequency of the excitation signal when the vibration state information signal obtained changes discontinuously or (ii) a time corresponding to the frequency; and a converter that determines a physical quantity acting on the MEMS resonator based on the detection value detected.

A MEMS pressure sensor is provided having a membrane made with one of plurality of metal layers. A lid is positioned above the membrane and connected to a plurality of cavity walls at distal ends of the membrane. The lid includes an array of holes positioned on a region of the lid. A fixed metal electrode is positioned below the lid.

Disclosed is a MEMS chip that in certain embodiments includes a substrate with a back cavity, and a plate capacitor bank provided on the substrate; the plate capacitor bank at least includes a first plate capacitor structure and a second plate capacitor structure located below the first plate capacitor structure and arranged in parallel with the first plate capacitor structure; the first plate capacitor structure includes a first diaphragm and a first hack electrode; and the second plate capacitor structure includes a second. diaphragm and a second back electrode.

An apparatus comprising an array of polymer-based capacitive micromachined ultrasonic transducers positioned on a substrate. The substrate may be at least substantially transparent to ionizing radiation, be flexible, and/or have walls positioned thereon to protect the transducers.

Devices and methods for controlling molecular transport are disclosed herein. The devices include a membrane having a plurality of nanochannels extending therethrough. The membrane has an inner electrically conductive layer and an outer dielectric layer. The outer dielectric layer creates an insulative barrier between the electrically conductive layer and the contents of the nanochannels. At least one electrical contact region is positioned on a surface of the membrane. The electrical contact region exposes the electrically conductive layer of the membrane for electrical coupling to external electronics. When the membrane is at a first voltage, molecules flow through the nanochannels at a first release rate. When the membrane is at a second voltage, charge accumulation within the nanochannels modulates the flow of molecules through the nanochannels to a second release rate that is different than the first release rate. Methods of fabricating devices for controlling molecular transport are also disclosed herein.

A device includes a substrate comprising a first standoff, a second standoff, a third standoff, a first cavity, a second cavity, and a bonding material covering a portion of the first, the second, and the third standoff. The first cavity is positioned between the first and the second standoffs, and the second cavity is positioned between the second and the third standoffs. The first cavity comprises a first cavity region and a second cavity region separated by a portion of the substrate extruding thereto, and wherein a depth associated with the first cavity region is greater than a depth associated with the second cavity. A surface of the first cavity is covered with a getter material.

A MEMS infrared sensing device includes a substrate and an infrared sensing component. The infrared sensing component is provided above the substrate. The infrared sensing component includes a sensing plate and at least one supporting element. The sensing plate includes at least one infrared absorbing layer, an infrared sensing layer, a sensing electrode and a plurality of metallic elements. The sensing plate has a plurality of openings. The metallic elements respectively surround the openings. The sensing electrode is connected with the infrared sensing layer, and the metallic elements are spaced apart from one another. The supporting element connecting the sensing plate with the substrate.

A MEMS device can include a first support layer, a second support layer, and a solid dielectric suspended between the first support layer and the second support layer. The solid dielectric can move relative to the first support layer and the second support layer and can include a plurality of apertures. The MEMS device can include a first plurality of electrodes coupled to the first support layer and the second support layer and extending through a first subset of the plurality of apertures. The MEMS device can include a second plurality of electrodes coupled to the first support layer and extending partially into a second subset of the plurality of apertures. The MEMS device can include a third plurality of electrodes coupled to the second support layer and extending partially into a third subset of the plurality of apertures.

A first electrode of a MEMS device can be oriented lengthwise along and parallel to an axis, and can have a first end and a second end. A second electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. A third electrode can be oriented lengthwise along and parallel to the axis and can have a first end and a second end. The first, second, and third electrodes can each be located at least partially within an aperture of a plurality of apertures of a solid dielectric that can surround the second electrode second end and the third electrode first end. The second electrode first end and the third electrode second end can be located outside of the solid dielectric.

A micro-electronic non-landing mirror system includes a substrate, at least two supporting assemblies, at least two driving electrodes, a rotating mirror, and a driving circuit. The rotating mirror is elastically supported on the supporting assemblies through elastic reset assemblies. When the driving circuit applies a driving voltage, the rotating mirror moves closer to the driving electrode to which the driving voltage is applied within a range of movement that does not land on the substrate. When the driving circuit removes the driving voltage, the rotating mirror gets back to move away from the driving electrode under elastic restoring force of the elastic reset assemblies. Each elastic reset assembly includes at least two elastic reset units connected to different corners of the rotating mirror by a corresponding one supporting assembly. Each elastic reset unit is configured for providing the rotating mirror with at least two rotational degrees of freedom.