B81B2207/03

DETECTING AND RESPONDING TO LIGHT SOURCE FAILURE

In various examples, a head-mountable display (“HMD”) may include a light source to emit light across a target region of a wearer, a light sensor, and a circuitry operably coupled with the light source and the light sensor. The circuitry may operate the light source to periodically emit light across the light sensor. Based on a determination that a time interval since the circuitry last received a signal from the light sensor satisfies a threshold, the circuitry may trigger a remedial action to cause the light source to cease emission of light across the target region of the wearer.

METHOD TO ESTIMATE PHASE AND AMPLITUDE FOR CONTROL OF A RESONANT MEMS MIRROR

Techniques to be described herein are based upon the combination of a digital lock-in amplifier approach with a numerical method to yield accurate estimations of the amplitude and phase of a sense signal obtained from a movement sensor associated with a resonant MEMS device such as a MEMS mirror. The techniques described herein are efficient from a computational point of view, in a manner which is suitable for applications in which the implementing hardware is to follow size and power consumption constraints.

MICRO ELECTRO-MECHANICAL SYSTEM SENSOR

Provided is a micro electro-mechanical system (MEMS) sensor including a substrate including a first cavity, a first frame including a second cavity at least partially overlapping the first cavity, at least a portion of the first frame being spaced apart from the substrate, a plurality of resonators, each of the plurality of resonators including a first end connected to the first frame and a second end extending into the second cavity, and a second frame including a first region connected to the first frame and a second region spaced apart from the first frame and connected to the substrate.

Microfluidic device, method of using microfluidic device and micro total analysis system

A microfluidic device, a method of using a microfluidic device and a micro total analysis system are provided. The microfluidic device includes a first substrate, and the first substrate includes a base substrate and a pixel array. The pixel array includes a plurality of pixels and is on the base substrate, and each of the plurality of pixels includes a driving electrode. Driving electrodes of two adjacent pixels are in different layers.

MEMS CHIP AND ELECTRIC DEVICE

Disclosed are a MEMS chip and an electronic device. The chip can include a substrate having a back cavity, as well as a back electrode and an induction membrane both disposed on the substrate, wherein the back electrode and the induction membrane are located on the back cavity and constitute a capacitor structure, the induction membrane comprises an active area opposite to the back cavity, an inactive area disposed outside the active area, and an isolation area located between the active area and the inactive area, and the isolation area comprises two insulation loops connected to the active area and the inactive area respectively, and a buffer area connected between the two insulation loops, both of the insulation loops being disposed around the active area.

REDUCTION OF RINGING AND INTERMODULATION DISTORTION IN A MEMS DEVICE
20230101598 · 2023-03-30 ·

Described embodiments include a microelectromechanical system (MEMS) array comprising a first MEMS device that includes a first movable electrostatic plate elastically connected to a first structure, the first movable electrostatic plate having a first mass, a first fixed electrostatic plate, and a first drive circuit having a first drive output coupled to the first fixed electrostatic plate. There is a second MEMS device that includes a second movable electrostatic plate elastically connected to a second structure, the second movable electrostatic plate having a second mass that is different than the first mass, a second fixed electrostatic plate, and a second drive circuit having a second drive output coupled to the second fixed electrostatic plate.

SENSOR CHIP WITH A PLURALITY OF INTEGRATED SENSOR CIRCUITS

The present disclosure relates to a sensor chip, including a semiconductor substrate, a first sensor circuit monolithically integrated into the semiconductor substrate, at least one second sensor circuit monolithically integrated into the semiconductor substrate, wherein the first and second integrated sensor circuits are embodied identically.

Seismic acquisition system and sensor based on MEMS sensor with low power consumption

The present disclosure belongs to the field of geological exploration, and particularly relates to a seismic acquisition system and a sensor based on an MEMS sensor with low power consumption, so as to solve the problem that the existing seismic wave acquisition technology cannot balance high accuracy and low power consumption when the MEMS sensor is used. The present disclosure comprises: the MEMS sensor is used for receiving seismic wave signals and outputting MEMS sensor electrical signals; a common-mode voltage adjustment module is used for adjusting the MEMS sensor signals to be within the input range of common-mode voltage of a readout circuit, so as to obtain low voltage MEMS sensor signals. In the present disclosure, high voltage ensures the detection accuracy of the MEMS sensor; and low voltage is supplied to the readout circuit, thereby reducing the power consumption of the overall seismic acquisition system.

Method for detecting contamination of a MEMS sensor element

A method for detecting contamination of a microelectromechanical sensor element. The method includes the following steps: outputting heating control signals for controlling a heating device in order to heat the sensor element, receiving measuring signals that represent a physical variable that is measured with the aid of the heated sensor element, ascertaining, based on the measured physical variable, whether the sensor element has contamination or is free of contamination, outputting result signals that represent a result indicating whether the sensor element has contamination or is free of contamination. Moreover, a device is described.

CHARGE TRANSFER CIRCUITRY FOR MEMS DEVICES

Microelectromechanical system (MEMS) devices, methods of operating the MEMS device, and methods of manufacturing the MEMS device are disclosed. In some embodiments, the MEMS device includes a glass substrate; an electrode on the glass substrate; a hinge mechanically coupled to the electrode; a membrane mirror mechanically coupled to the hinge; a TFT on the glass substrate and electrically coupled to the electrode; and a control circuit comprising: a multiplexer configured to turn on or turn off the TFT; and a drive source configured to provide a drive signal for charging the electrode through the TFT. An amplitude of the drive signal corresponds to an amount of charge, and the amount of charge generates an electrostatic force for actuating the hinge and a portion of the membrane mirror mechanically coupled to the hinge. In some embodiments, the MEMS devices comprise a charge transfer circuit for providing the amount of charge.