A nanohole template is disclosed which includes a substrate and a vertically aligned nanocomposite (VAN) structure disposed over the substrate. The VAN structure is a metal nitride having circular periodic nanoholes of about 2 nm to about 20 nm in diameter.

A MEMS pressure sensor is provided having a membrane made with one of plurality of metal layers. A lid is positioned above the membrane and connected to a plurality of cavity walls at distal ends of the membrane. The lid includes an array of holes positioned on a region of the lid. A fixed metal electrode is positioned below the lid.

The present invention relates to textile articles and clothing such as outdoor garments, indoor garments, and commercial protective wear exposed to contact mixtures of water and oil, swimwear and winter wear exposed to mixtures of water and air. At least part of these textile articles possess a surface provided with at least one of 1) a high surface area, 2) hierarchical pattern, 3) contact angles such that hydrophilic portion of a contact mixture possesses a high contact angle and the hydrophobic portion of a contact mixture possesses a low contact angle, and 4) hysteresis angle greater than 5 degrees. Hydrophobic/Hydrophilic contact mixtures of the present invention can be surfaces where water and or ice are present in combination with oil and or air. The textile articles of the present invention resist slippage on surfaces possessing hydrophobic/hydrophilic contact mixtures.

A microelectromechanical systems (MEMS) diaphragm assembly comprises a first diaphragm and a second diaphragm. A plurality of pillars connects the first and second diaphragms, wherein the plurality of pillars has a higher distribution density at a geometric center of the MEMS diaphragm assembly than at an outer periphery thereof.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.

In a method for creating hydrophilic surfaces or surface regions on one or more silicon surfaces of a substrate, a vapour phase of hydrogen peroxide is generated in a reactor by heating an aqueous hydrogen peroxide solution. The substrate having the silicon surface or surfaces to be treated is exposed to the vapour phase, whereby a hydrophilisation of the silicon surfaces in achieved.

A porous composite structure including a substrate including a plurality of nanostructures; a particle layer disposed on a surface of the substrate; and a liquid, a method of preparing the porous composite structure, an article including the porous composite structure, and an air purifier including the porous composite structure.

The present techniques relate to various aspects of forming and filling high-aspect ratio trench structures (e.g., trench structures having an aspect ratio of 20 or greater, including aspect ratios in the range of 20:1 up to and including 50:1 or greater) combined with trench opening widths ranging from 0.5 micron to 50 microns. In one implementation a method to fabricate high-aspect ratio trenches in silicon is provided using a patterned photoresist on evaporated aluminum. In accordance with this approach, a high-aspect ratio trench can be formed having vertical side walls and defect-free trench bottoms. In some instances it may be desirable to fill such high-aspect ratio trench structures with a metal or other substrate to provide certain functionality associated with the fill material. Further processes and structures are related in which such trench structures are filled using a mixture of high-Z nano-particles within an epoxy resin matrix.

A method for forming reliefs on a face of a substrate is provided, successively including forming a protective screen for protecting at least a first zone of the face; an implanting to introduce at least one species comprising carbon into the substrate from the face of the substrate, the forming of the protective screen and the implanting being configured to form, in the substrate, at least one carbon modified layer having a concentration of implanted carbon greater than or equal to an etching threshold only from a second zone of the face of the substrate not protected by the protective screen; removing the protective screen; and etching the substrate from the first zone selectively with respect to the second zone.