A micro-electronic non-landing mirror system includes a substrate, at least two supporting assemblies, at least two driving electrodes, a rotating mirror, and a driving circuit. The rotating mirror is elastically supported on the supporting assemblies through elastic reset assemblies. When the driving circuit applies a driving voltage, the rotating mirror moves closer to the driving electrode to which the driving voltage is applied within a range of movement that does not land on the substrate. When the driving circuit removes the driving voltage, the rotating mirror gets back to move away from the driving electrode under elastic restoring force of the elastic reset assemblies. Each elastic reset assembly includes at least two elastic reset units connected to different corners of the rotating mirror by a corresponding one supporting assembly. Each elastic reset unit is configured for providing the rotating mirror with at least two rotational degrees of freedom.

A method of manufacturing a semiconductor structure includes following operations. A first substrate is provided. A plate is formed over the first substrate. The plate includes a first tensile member, a second tensile member, a semiconductive member between the first tensile member and the second tensile member, and a plurality of apertures penetrating the first tensile member, the semiconductive member and the second tensile member. A membrane is formed over and separated from the plate. The membrane include a plurality of holes. A plurality of conductive plugs passing through the plate or membrane are formed. A plurality of semiconductive pads are formed over the plurality of conductive plugs. The plate is bonded to a second substrate. The second substrate includes a plurality of bond pads, and the semiconductive pads are in contact with the bond pads.

A micromechanical component for a sensor device. The component includes a first seismic mass, the first seismic mass displaced out of its first position of rest by a first limit distance into a first direction along a first axis mechanically contacting a first stop structure, and including a second seismic mass which is displaceable out of its second position of rest at least along a second axis, the second axis lying parallel to the first axis or on the first axis, and a second stop surface of the second seismic mass, displaced out of its second position of rest into a second direction counter to the first direction along the second axis, mechanically contacting a first stop surface of the first seismic mass adhering to the first stop structure.

A micromechanical z-inertial sensor. The micromechical z-inertial sensor includes at least one first seismic mass element; and torsion spring elements joined to the first seismic mass element. In each case, first torsion spring elements are connected to a substrate, and second torsion spring elements are connected to the first seismic mass element. A first and a second torsion spring element in each case is joined to one another with the aid of a lever element. The lever element is designed to strike against a stop element.

In described examples, a system (e.g., a microelectromechanical system) includes a substrate, a support coupled to the substrate and a first and second element. The first element includes a contactor spring having a first portion coupled to the support and having a second portion including a cavity having a sloped surface. A clearance from the sloped surface to the substrate is widened as the sloped surface extends away from the first portion. The second portion includes a first contact surface adjacent to the sloped surface. The second element is coupled to the substrate and has a second contact surface adjacent to the first contact surface. One of the first element and the second element is adapted: in a first direction to urge the first contact surface and the second contact surface together; and in a second direction to urge the first contact surface and the second contact surface apart.

Systems and Apparatus for micromirror designs with electrode contact. In some examples, a micromirror including a mirror, a mirror via coupled to the mirror, a hinge coupled to the mirror via, the hinge including a springtip associated with a first side of the micromirror, the springtip associated with a first terminal, and an electrode associated with the first side of the micromirror, the electrode having a dielectric coating in contact with the springtip, the electrode associated with a second terminal different than the first terminal.

An electrostatic actuator includes a base, a movable electrode including a semiconductor and supported to the base to be displaceable in a first direction, and a fixed electrode including the semiconductor and fixed to the base, in which the fixed electrode faces the movable electrode in a state of being separated therefrom in the first direction. The electrostatic actuator includes a high-resistance region formed in at least a portion of each of respective facing surfaces of the movable electrode and the fixed electrode, and lower in impurity concentration than a surrounding region thereof.

Microelectromechanical systems (MEMS) sensors and related bias voltage techniques are described. Exemplary MEMS sensors, such as exemplary MEMS acoustic sensors or microphones described herein can employ one or more bias voltage generators and single-ended or differential amplifier arrangements. Various embodiments are described that can effectively increase the bias voltage available to the sensor element without resorting to high breakdown voltage semiconductor processes. In addition, control of the one or more bias voltage generators in various operating modes is described, based on consideration of a number of factors.

A micromechanical component for a sensor device. The component includes a first seismic mass, the first seismic mass displaced out of its first position of rest by a first limit distance into a first direction along a first axis mechanically contacting a first stop structure, and including a second seismic mass which is displaceable out of its second position of rest at least along a second axis, the second axis lying parallel to the first axis or on the first axis, and a second stop surface of the second seismic mass, displaced out of its second position of rest into a second direction counter to the first direction along the second axis, mechanically contacting a first stop surface of the first seismic mass adhering to the first stop structure.

A microelectromechanical system, including a substrate having a major plane of extension. The microelectromechanical system includes a mass structure. The mass structure is formed to be movable relative to the substrate in a vertical direction, perpendicularly to the major plane of extension. The mass structure includes an electrode structure. The substrate includes a counter-electrode structure. The electrode structure and the counter-electrode structure are coupled capacitively. The mass structure has a deformation in a resting state of the microelectromechanical system. The electrode structure and/or the counter-electrode structure are formed as a function of the deformation of the mass structure.