A Light Detection and Ranging (LiDAR) module for a vehicle can include a semiconductor integrated circuit with a microelectromechanical system (MEMS) and a substrate, the MEMS comprising a micro-mirror assembly including a mirror and a gimbal structure. The gimbal can be configured concentrically around and coplanar with the mirror. When rotated, the gimbal drives the mirror to oscillate at or near a resonant frequency and is coupled to the mirror via mirror-gimbal connectors. A support structure can be coupled to a backside of the mirror and gimbal structures and can increase the stiffness of the mirror to help the mirror better resist dynamic deformation. To limit the added rotational moment of inertia, the support structure can be etched to form a matrix of cells (e.g., formed by a mesh of circumferential and radial ridges) such that up to approximately 90% of the support structure material forming the support structure is removed.

A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.

Systems and Apparatus for micromirror designs with electrode contact. In some examples, a micromirror including a mirror, a mirror via coupled to the mirror, a hinge coupled to the mirror via, the hinge including a springtip associated with a first side of the micromirror, the springtip associated with a first terminal, and an electrode associated with the first side of the micromirror, the electrode having a dielectric coating in contact with the springtip, the electrode associated with a second terminal different than the first terminal.

A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.

The present invention relates to the fields of physics, material sciences and micro and nano electronics, and concerns a method for producing a rolled-up electrical or electronic component, as can be used for example as a capacitor, or in aerials. The object of the present invention is to provide a low-cost, environmentally friendly and time-saving method for producing a rolled-up electrical or electronic component with many windings. The object is achieved by a method for producing a rolled-up component in which at least two functional and insulating layers, alternately arranged fully or partially over one another, are applied to a substrate with a sacrificial layer, wherein at least the functional or insulating layer that is arranged directly on the sacrificial layer has a perforation, at least on the two sides that are arranged substantially parallel to the rolling direction.

A MEMS vibration sensor die can include a substrate having a top portion, a mounting surface, and an aperture extending at least partially through the substrate. The die can include a first electrode coupled to the top portion of the substrate and positioned over the aperture. The die can include a second electrode disposed between the substrate and the first electrode. The second electrode can be spaced apart from the first electrode. The die can include a proof mass that can have a first portion coupled to the first electrode or the second electrode. The proof mass can have a second end opposite the first portion. The second end can be recessed within the aperture relative to the mounting surface of the substrate. The proof mass can be suspended freely within the aperture. The proof mass can move the first electrode or the second electrode from which it is suspended in response to vibration.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

Described is a micro-lattice damping material and a method for repeatable energy absorption. The micro-lattice damping material is a cellular material formed of a three-dimensional interconnected network of hollow tubes. This material is operable to provide high damping, specifically acoustic, vibration or shock damping, by utilizing the energy absorption mechanism of hollow tube buckling, which is rendered repeatable by the micro-lattice architecture.

A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.

A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.