The invention relates to an electromechanical microsystem 1 including at least two electromechanical transducers 11 a and 11 b, a deformable diaphragm 12 and a cavity 13 hermetically containing a deformable medium 14 maintaining a constant volume under the action of an external pressure change. The deformable diaphragm forms a cavity wall and has at least one elastically deformable free area 121. The electromechanical transducers are configured so that their movement is a function of the said external pressure change, and vice versa, and so that two of them have opposing movements relative to each other. The free area cooperates with an external member 2 so that its deformation causes, or is caused by, a movement of the external member. The electromechanical microsystem is thus able to move the external member and/or sense a movement of this member, alternately towards the inside or outside of the cavity.

The invention relates to an electromechanical microsystem 1 including at least two electromechanical transducers 11 and 11a, a deformable diaphragm 12 and a cavity 13 hermetically containing a deformable medium 14 maintaining a constant volume under the action of an external pressure change. The deformable diaphragm forms a cavity wall and has at least one deformable free area 121. The electromechanical transducers are configured so that their movement is a function of the said external pressure change, and conversely, and be in the same direction for at least two of them. The electromechanical microsystem 1 is thus able to deform the free area of the diaphragm in step mode towards the inside or outside of the cavity.

A micromechanical component for a capacitive sensor or switch device, having a substrate having a substrate surface, a diaphragm mounted on the substrate surface having a self-supporting region, at least one lever element and at least one first electrode connected to the at least one lever element. The at least one lever element is connected to the diaphragm in such a way that when there is a warping of the self-supporting region of the diaphragm the at least one lever element is set into a rotational movement, whereby the at least one connected first electrode is set into a first adjustment movement oriented at an angle to the substrate surface. The at least one lever element and the at least one first electrode connected to the at least one lever element are situated between the substrate surface and the diaphragm inner side of the self-supporting region of the diaphragm.

A microsystem has a first support element and a second support element, wherein a relative position of the first support element and the second support element among each other is variable. The microsystem has a permanent-magnetic unit connected to the first support element in a mechanically fixed manner and configured to generate a magnetic field. Additionally, the microsystem has a sensor unit connected to the second support element in a mechanically fixed manner and configured to detect the magnetic field and provide a sensor signal which is based on the magnetic field. The sensor signal indicates a relative position of the support elements among one another.

A micromechanical sensor includes a substrate having a cavity; a flexible diaphragm spanning the cavity; and a lever element that spans the diaphragm and has a first and second end section on opposite sides of a center section. A first joint element is between the first end section and the substrate and a second joint element is between the center section and the diaphragm. The lever element can be pivoted due to a deflection of the diaphragm. Two capacitive sensors are provided, each having two electrodes, one electrode of each sensor being mounted at one of the end sections of the lever element, and the other being mounted on the substrate. The electrodes are disposed so that distances between the electrodes of different sensors are influenced oppositely when the lever element is pivoted. Also, an actuator is provided for applying an actuating force between the lever element and the substrate.

A microdevice (100) comprising a movable element (111) capable of moving relative to a fixed part (115), produced in first and second layers of material (104, 106) arranged one above the other such that the movable element comprises a portion (112) of the first layer and a portion (118) of the second layer secured to each other, and wherein the movable element is suspended from the fixed part by a suspension structure (121) formed in the first and/or second layer of material.

A MEMS transducer for a microphone includes a closed chamber, an array of conductive pins, a dielectric grid, and a diaphragm. The closed chamber is at a pressure lower than atmospheric pressure. The array of conductive pins is in a fixed position in the closed chamber, distributed in two dimensions, and have gaps formed therebetween. The dielectric grid is positioned within the closed chamber, includes a grid of dielectric material positioned between the gaps of the array of conductive pins, and is configured to move parallel to the conductive pins. The diaphragm is configured to form a portion of the closed chamber and deflect in response to changes in a differential pressure between the pressure within the closed chamber and a pressure outside the transducer. The diaphragm is configured to move the dielectric grid relative to the array of conductive pins in response to a change in the differential pressure.

A sealing device for sealing a space filled with a fluid in a MEMS sensor system. The sealing device includes a sealing unit, the sealing unit encompassing a channel, which is connected to the one space, and a sealing element for sealing the channel being situated in the channel in such a way that the channel and/or the sealing element are/is designed in such a way that the sealing element is sealingly fixed in the channel via a mechanical clamping.

A MEMS transducer for a microphone includes a closed chamber, an array of conductive pins, a dielectric grid, and a diaphragm. The closed chamber is at a pressure lower than atmospheric pressure. The array of conductive pins is in a fixed position in the closed chamber, distributed in two dimensions, and have gaps formed therebetween. The dielectric grid is positioned within the closed chamber, includes a grid of dielectric material positioned between the gaps of the array of conductive pins, and is configured to move parallel to the conductive pins. The diaphragm is configured to form a portion of the closed chamber and deflect in response to changes in a differential pressure between the pressure within the closed chamber and a pressure outside the transducer. The diaphragm is configured to move the dielectric grid relative to the array of conductive pins in response to a change in the differential pressure.

A gyro sensor includes a plurality of beams connected via a turnaround part. A groove is provided on a main surface of at least one beam of the plurality of beams. Wall thicknesses on the main surface of two sidewalls facing each other of the groove in a direction orthogonal to a longitudinal direction of the beam satisfy 0.9≤T1/T2≤1.1, where T1 is the wall thickness of one sidewall and T2 is the wall thickness of the other sidewall.