A sensor unit includes a transducer element monitoring a measurand and generating an electrical output signal correlated with the measurand, a sensor substrate having a first surface and an opposite second surface, a recess extending from the first surface of the substrate through to the second surface of the substrate, and a circuit carrier. The transducer element and a first electrically conductive contact pad are arranged on the first surface and electrically connected. The circuit carrier has a second electrically conductive contact pad. The sensor substrate is mounted on the circuit carrier with the first surface facing the circuit carrier. The first electrically conductive contact pad and the second electrically conductive contact pad are interconnected by an electrically conductive material filled in from the second surface towards the first surface of the sensor substrate.

An ultrasonic device includes a substrate, a transmitter disposed over the substrate, the transmitter including an ultrasonic transmitting transducer configured to generate ultrasonic signals, and a receiver disposed over the substrate, the receiver including an ultrasonic receiving transducer configured to sense ultrasonic signals. The ultrasonic device further includes a first horn-shaped acoustic channel, wherein a material of at least one portion of the first horn-shaped acoustic channel is the same as a material of at least one portion of the transmitter or the receiver.

A structure of micro-electro-mechanical-system microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, the dielectric layer has a second opening, corresponding to the first opening. A diaphragm is located within the second opening, having an embedded part held by the dielectric layer and an exposed part exposed by the second opening. The exposed part has a junction peripheral region, a buffer peripheral region and a central region. The junction region has an elastic structure with slits, the buffer peripheral region includes a plurality of holes and is disposed between the junction peripheral region and the central region. A backplate is disposed on the dielectric layer above the second opening, wherein the backplate includes venting holes distributed at a region corresponding to the central part of the diaphragm.

A passive micromechanical counter for counting and storing a number of mechanical pulses includes at least one memory cell, the memory cell having a cell input, a latching mechanism and an electromechanical coding unit, the cell input being designed to mechanically transmit the mechanical pulse to the latching mechanism, and the latching mechanism being designed to store the number of mechanical pulses transmitted by means of its discrete latching position. It is provided that an electrical digital signal can be generated by applying an electrical voltage to the electromechanical coding unit, the electrical digital signal representing the discrete latching position of the latching mechanism.

An actuator and a manufacture method thereof, an operation method thereof, and a movable device. The actuator includes a photodeformation layer and a first driving unit, the first driving unit includes at least one first light emitting device, the first light emitting device is connected to a first side of the photodeformation layer, the first light emitting device is capable of emitting first light with a first wavelength to irradiate onto the photodeformation layer, and the photodeformation layer can generate a first deformation under irradiation of the first light.

A microchannel device includes: a channel unit which is configured of a plurality of channel members which are laminated in a thickness direction to define a microchannel, at least one of the channel members being made of a material having elasticity; and a holding member which is provided separately from or integrally with the channel unit and holds the channel unit in a state of being compressed in the thickness direction.

An actuator and a manufacture method thereof, an operation method thereof, and a movable device. The actuator includes a photodeformation layer and a first driving unit, the first driving unit includes at least one first light emitting device, the first light emitting device is connected to a first side of the photodeformation layer, the first light emitting device is capable of emitting first light with a first wavelength to irradiate onto the photodeformation layer, and the photodeformation layer can generate a first deformation under irradiation of the first light.

A structure of micro-electro-mechanical-system microphone includes a substrate of semiconductor, having a first opening in the substrate. A dielectric layer is disposed on the substrate, the dielectric layer has a second opening, corresponding to the first opening. A diaphragm is located within the second opening, having an embedded part held by the dielectric layer and an exposed part exposed by the second opening. The exposed part has a junction peripheral region, a buffer peripheral region and a central region. The junction region has an elastic structure with slits, the buffer peripheral region includes a plurality of holes and is disposed between the junction peripheral region and the central region. A backplate is disposed on the dielectric layer above the second opening, wherein the backplate includes venting holes distributed at a region corresponding to the central part of the diaphragm.

The application describes a moulded interposer member for a MEMS transducer package. The interposer member comprises a void region and at least one through hole or channel.

A sensor unit includes a transducer element monitoring a measurand and generating an electrical output signal correlated with the measurand, a sensor substrate having a first surface and an opposite second surface, a recess extending from the first surface of the substrate through to the second surface of the substrate, and a circuit carrier. The transducer element and a first electrically conductive contact pad are arranged on the first surface and electrically connected. The circuit carrier has a second electrically conductive contact pad. The sensor substrate is mounted on the circuit carrier with the first surface facing the circuit carrier. The first electrically conductive contact pad and the second electrically conductive contact pad are interconnected by an electrically conductive material filled in from the second surface towards the first surface of the sensor substrate.