An imprint apparatus, comprises: a discharge unit that discharges a liquid onto a substrate; a storage unit that stores a plurality of discharge conditions for the discharge unit; and a control unit that controls the discharge unit based on a discharge condition that is stored in the storage unit, wherein the control unit selects the discharge condition from the plurality of discharge conditions in accordance with a discharge spacing for discharging the liquid.

An imprint apparatus, comprises: a discharge unit that discharges a liquid onto a substrate; a storage unit that stores a plurality of discharge conditions for the discharge unit; and a control unit that controls the discharge unit based on a discharge condition that is stored in the storage unit, wherein the control unit selects the discharge condition from the plurality of discharge conditions in accordance with a discharge spacing for discharging the liquid.

According to one embodiment, a pattern formation method includes forming a structure body on a first surface of a patterning member, the structure body having protrusions and a recess. The protrusions are arranged at a first pitch along a first direction. The first direction is aligned with the first surface. The recess is between the protrusions. The method further includes forming a resin film of a block copolymer on the structure body. The block copolymer includes first portions and second portions. The first and second portions are arranged alternately at a second pitch along the first direction. The structure body includes first and second regions. The first portions are on the first regions. The second portions on the second regions. The method further includes removing the second portions and the second regions, introducing a metal to the first regions, and etching the patterning member using the first regions.

A method for producing a composite cap element for encapsulation of a MEMS component includes providing a base substrate having a window formed through an opening, providing a transparent cover substrate for transparently covering the window in the base substrate, producing a hermetic connection between the base substrate and the cover substrate in a connection region which extends peripherally around the window, heating the interconnected substrates in an edge region of the window to a temperature at which the base substrate becomes deformable and the cover substrate remains dimensionally stable, and displacing the dimensionally stable cover substrate in the region of the window while simultaneously deforming the deformable base substrate in a region around the window. A composite cap element is also provided.