Patent classifications
B81C1/00468
Packaging of microelectromechanical system devices
According to an example aspect of the present invention, there is provided a package for a Microelectromechanical System, MEMS, device comprising a cap layer and the MEMS device below the cap layer, at least two electrodes on a surface of the MEMS device to enable electrical functioning of the MEMS device, wherein each electrode is located on a horizontal plane and comprises metal to enable formation of an air-path, the air-path between the cap layer and the MEMS device to enable releasing of the MEMS device, at least a part of the air-path being on the same horizontal plane wherein the at least two electrodes are located and a side access port connected to the air-path to enable releasing of the MEMS device, wherein the side access port goes through the cap layer.
FABRICATION AND SELF-ALIGNED LOCAL FUNCTIONALIZATION OF NANOCUPS AND VARIOUS PLASMONIC NANOSTRUCTURES ON FLEXIBLE SUBSTRATES FOR IMPLANTABLE AND SENSING APPLICATIONS
Methods for fabricating flexible substrate nanostructured devices are disclosed. The nanostructures comprise nano-pillars and metallic bulbs or nano-apertures. The nanostructures can be functionalized to detect biological entities. The flexible substrates can be rolled into cylindrical tubes for detection of fluidic samples.
Dual micro-electro mechanical system and manufacturing method thereof
A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.