The present disclosure includes apparatuses and methods related to freezing a sacrificial material in forming a semiconductor. In an example, a method may include solidifying, via freezing, a sacrificial material in an opening of a structure, wherein the sacrificial material has a freezing point below a boiling point of a solvent used in a wet clean operation and removing the sacrificial material via sublimation by exposing the sacrificial material to a particular temperature range.

A Micro-Electro-Mechanical System (MEMS) device includes a substrate, a packaging component provided on the substrate and a MEMS component provided inside the packaging component and on the substrate. The device further includes a sealing component. The sealing component is provided on the substrate and/or the packaging component, for preventing an external small molecule from contacting with the MEMS component.

The present disclosure provides a pressure sensor, including a chamber and a film. The chamber includes a first wall with a first electrode and a second wall with a second electrode. The first wall faces the second wall, and the first electrode and the second electrode respectively include conductive or semiconductive material. The film lines a surface inside the chamber exclusive of the first electrode and the second electrode for blocking outgassing entering the chamber from the surface. A method of manufacturing the pressure sensor is also disclosed.

In described examples, a cavity is formed between a substrate and a cap. One or more access holes are formed through the cap for removing portions of a sacrificial layer from within the cavity. A cover is supported by the cap, where the cover is for occulting the one or more access holes along a perspective. An encapsulant seals the cavity, where the encapsulant encapsulates the cover and the one or more access holes.

In described examples, a cavity is formed between a substrate and a cap. One or more access holes are formed through the cap for removing portions of a sacrificial layer from within the cavity. A cover is supported by the cap, where the cover is for occulting the one or more access holes along a perspective. An encapsulant seals the cavity, where the encapsulant encapsulates the cover and the one or more access holes.

A method of manufacturing a display apparatus is presented. The method includes sequentially forming a conductive layer and a low reflection layer above a substrate; forming a first low reflection layer including a lower layer having conductivity and an upper layer above the lower layer, a pixel electrode, and a low reflection etching layer above the pixel electrode by patterning the conductive layer and the low reflection layer; forming a pixel-defining layer above the first low reflection layer and having an opening exposing at least a part of the low reflection etching layer; exposing the pixel electrode by etching at least a part of the low reflection etching layer by using the pixel-defining layer as a mask; forming an intermediate layer above the exposed pixel electrode, the intermediate layer comprising an organic emission layer; and forming an opposite electrode above the intermediate layer.

Methods for depositing a measured amount of a species in a sealed cavity. In one example, a method for depositing molecules in a sealed cavity includes depositing a selected number of microcapsules in a cavity. Each of the microcapsules contains a predetermined amount of a first fluid. The cavity is sealed after the microcapsules are deposited. After the cavity is sealed the microcapsules are ruptured to release molecules of the first fluid into the cavity.

A method for forming a micro-electro mechanical system (MEMS) device is provided. The method includes forming a first dielectric layer over a semiconductor layer and forming a blocking layer over the first dielectric layer. The method also includes bonding a CMOS substrate with the blocking layer, and the CMOS substrate includes a second dielectric layer, and the blocking layer is configured to block gas coming from the second dielectric layer. The method further includes partially removing the first dielectric layer to form a cavity between the semiconductor layer and the blocking layer. A portion of the semiconductor layer above the cavity becomes a movable element. In addition, the method includes sealing the cavity such that a closed chamber is formed to surround the movable element.

A method of manufacturing a display apparatus is presented. The method includes sequentially forming a conductive layer and a low reflection layer above a substrate; forming a first low reflection layer including a lower layer having conductivity and an upper layer above the lower layer, a pixel electrode, and a low reflection etching layer above the pixel electrode by patterning the conductive layer and the low reflection layer; forming a pixel-defining layer above the first low reflection layer and having an opening exposing at least a part of the low reflection etching layer; exposing the pixel electrode by etching at least a part of the low reflection etching layer by using the pixel-defining layer as a mask; forming an intermediate layer above the exposed pixel electrode, the intermediate layer comprising an organic emission layer; and forming an opposite electrode above the intermediate layer.

A pressure sensor device which uses appropriate passivation materials/patterns to make the device more robust and resistant to a hot and humid environment. The pressure sensor device uses moisture resistant passivation material(s) covering exposed glass areas, including sidewalls, and bonding interfaces to avoid the glass and bonding interfaces absorbing and reacting with moisture, thus maintaining the integrity of the device output after exposure in a humid/hot environment. These passivation materials/patterns used for the MEMS devices described may be applied to any MEMS based sensors and actuators using glass as one type of material for fabrication. The pressure sensor devices may be front side absolute pressure sensors, differential pressure sensors, or back side absolute pressure sensors.