Patent classifications
B81C2201/0114
Flexible electrode and preparation method thereof
A method for preparing a flexible electrode is provided. The method comprises sequentially forming a flexible base layer and an intermediate conductive layer on a carrier plate; treating an elastomeric template having an electrode pattern with an acid, followed by transferring and printing the electrode pattern onto the intermediate conductive layer to form an electrode inducing layer; forming a titanium dioxide-polydopamine composite layer in a gap of the electrode inducing layer; forming a platinum electrode layer on the titanium dioxide-polydopamine composite layer; removing the carrier plate. The invention solves the problems of slow formation of a polydopamine film and slow formation of a platinum electrode layer. A flexible electrode is further provided.
FEEDBACK CONTROL OF DIMENSIONS IN NANOPORE AND NANOFLUIDIC DEVICES
Nanofluidic passages such as nanochannels and nanopores are closed or opened in a controlled manner through the use of a feedback system. An oxide layer is grown or removed within a passage in the presence of an electrolyte until the passage reaches selected dimensions or is closed. The change in dimensions of the nanofluidic passage is measured during fabrication. The ionic current level through the passage can be used to determine passage dimensions. Fluid flow through an array of fluidic elements can be controlled by selective oxidation of fluidic passages between elements.
Ultra-high charge density electrets and method of making same
An ultra-high charge density electret is disclosed. The ultra-high charge density electret includes a three-dimensional structure having a plurality of sidewalls. A porous silicon dioxide film is formed on the plurality of sidewalls, and the porous silicon dioxide film is charged with a plurality of positive or negative ions.
Feedback control of dimensions in nanopore and nanofluidic devices
Nanofluidic passages such as nanochannels and nanopores are closed or opened in a controlled manner through the use of a feedback system. An oxide layer is grown or removed within a passage in the presence of an electrolyte until the passage reaches selected dimensions or is closed. The change in dimensions of the nanofluidic passage is measured during fabrication. The ionic current level through the passage can be used to determine passage dimensions. Fluid flow through an array of fluidic elements can be controlled by selective oxidation of fluidic passages between elements.
Feedback control of dimensions in nanopore and nanofluidic devices
Nanofluidic passages such as nanochannels and nanopores are closed or opened in a controlled manner through the use of a feedback system. An oxide layer is grown or removed within a passage in the presence of an electrolyte until the passage reaches selected dimensions or is closed. The change in dimensions of the nanofluidic passage is measured during fabrication. The ionic current level through the passage can be used to determine passage dimensions. Fluid flow through an array of fluidic elements can be controlled by selective oxidation of fluidic passages between elements.
Method of forming local nano/micro size structures of anodized metal
The invention presents a method for producing micro- or nano-structures of an anodized valve metal on a substrate. The method allows for accurate production of the structures, involves a small number of steps and is highly repeatable.
ULTRA-HIGH CHARGE DENSITY ELECTRETS AND METHOD OF MAKING SAME
An ultra-high charge density electret is disclosed. The ultra-high charge density electret includes a three-dimensional structure having a plurality of sidewalls. A porous silicon dioxide film is formed on the plurality of sidewalls, and the porous silicon dioxide film is charged with a plurality of positive or negative ions.
Spectrally and temporally engineered processing using photoelectrochemistry
Methods and apparatus for subtractively fabricating three-dimensional structures relative to a surface of a substrate and for additively depositing metal and dopant atoms onto the surface and for diffusing them into the bulk. A chemical solution is applied to the surface of the semiconductor substrate, and a spatial pattern of electron-hole pairs is generated by projecting a spatial pattern of illumination characterized by a specified intensity, wavelength and duration at each pixel of a plurality of pixels on the surface. An electrical potential is applied across the interface of the semiconductor and the solution with a specified temporal profile relative to the temporal profile of the spatial pattern of illumination. Such methods are applied to the fabrication of a photodetector integral with a parabolic reflector, cell size sorting chips, a three-dimensional photonic bandgap chip, a photonic integrated circuit, and an integrated photonic microfluidic circuit.
Spectrally and Temporally Engineered Processing using Photoelectrochemistry
Methods and apparatus for subtractively fabricating three-dimensional structures relative to a surface of a substrate and for additively depositing metal and dopant atoms onto the surface and for diffusing them into the bulk. A chemical solution is applied to the surface of the semiconductor substrate, and a spatial pattern of electron-hole pairs is generated by projecting a spatial pattern of illumination characterized by a specified intensity, wavelength and duration at each pixel of a plurality of pixels on the surface. Charge carriers are driven away from the surface of the semiconductor on a timescale short compared to the carrier recombination lifetime. Such methods are applied to creating a spatially varying doping profile in the semiconductor substrate, a photonic integrated circuit and an integrated photonic microfluidic circuit.
MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME
A microphone includes a substrate, an opening in the substrate, and a support structure in the opening. The support structure includes a first bracket formed in a closed-loop pattern and a second bracket connecting the first bracket to a periphery of the opening. The support structure in the opening increases the mechanical reliability of the microphone.