Patent classifications
B81C2201/0161
Method for coating microstructured components
The present disclosure provides a method for the surface modification of microstructured components having a polar surface, in particular for high-pressure applications. According to the method, a microstructured component is contacted, in particular treated, with a modification reagent, wherein the surface properties of the component are modified by chemical and/or physical interaction of the component surface and of the modification reagent.
MICROMECHANICAL COMPONENT AND METHOD FOR PRODUCING A MICROMECHANICAL COMPONENT
A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.
Process for Producing a Base of an Analysis Cell for Analyzing a Biochemical Material, and Analysis Cell
The disclosure relates to a process for producing a base of an analysis cell for analyzing a biochemical material. Here, carbon-rich precursor molecules and low-carbon precursor molecules are deposited on a substrate in a defined mixing ratio in order to form a precursor layer, wherein the low-carbon precursor molecules have a defined size and a hydrophobic end group. In a further step, the precursor layer is post-treated in a suitable manner in order to produce the base as a layer with at least one pore having a pore size dependent on the defined size and a pore count dependent on the defined mixing ratio.
Micromechanical component and method for producing a micromechanical component
A micromechanical component. The micromechanical component includes: a mount; a displaceable part; and a first serpentine spring and a second serpentine spring which is embodied mirror-symmetrically with respect to the first serpentine spring in terms of a first plane of symmetry; a first actuator device and a second actuator device being embodied in such a way that by way of the first actuator device and the second actuator device, periodic deformations, mirror-symmetrical in terms of the first plane of symmetry, of the first serpentine spring and of the second serpentine spring are excitable; the micromechanical component also encompassing a first torsion spring and a second torsion spring that each extend along a rotation axis; and the displaceable part being displaceable, at least by way of the periodic and mirror-symmetrical deformations of the first serpentine spring and of the second serpentine spring, around the rotation axis with respect to the mount.
MEMS capacitive pressure sensors in fully depleted semiconductor on insulator (FDSOI)
The present disclosure relates to semiconductor structures and, more particularly, to pressure sensors and methods of manufacture. The structure includes: a top membrane of semiconductor material having edges defined by epitaxial material and a liner material; a back gate under the top membrane; and a cavity defined between the top membrane and the back gate.
PRESSURE SENSORS
The present disclosure relates to semiconductor structures and, more particularly, to pressure sensors and methods of manufacture. The structure includes: a top membrane of semiconductor material having edges defined by epitaxial material and a liner material; a back gate under the top membrane; and a cavity defined between the top membrane and the back gate.
METHOD FOR COATING MICROSTRUCTURED COMPONENTS
The invention relates to a method for the surface modification of microstructured components having a polar surface, in particular for high-pressure applications. According to said method, a microstructured component is contacted, in particular treated, with a modification reagent, the surface properties of said component being modified by chemical and/or physical interaction of the component surface and of the modification reagent.
Process for producing a base of an analysis cell for analyzing a biochemical material, and analysis cell
The disclosure relates to a process for producing a base of an analysis cell for analyzing a biochemical material. Here, carbon-rich precursor molecules and low-carbon precursor molecules are deposited on a substrate in a defined mixing ratio in order to form a precursor layer, wherein the low-carbon precursor molecules have a defined size and a hydrophobic end group. In a further step, the precursor layer is post-treated in a suitable manner in order to produce the base as a layer with at least one pore having a pore size dependent on the defined size and a pore count dependent on the defined mixing ratio.
Cavity pressure modification using local heating with a laser
A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.
Metallizing MEMS devices
Various embodiments produce a semiconductor device, such a MEMS device, having metallized structures formed by replacing a semiconductor structure with a metal structure. Some embodiments expose a semiconductor structure to one or more a reacting gasses, such as gasses including tungsten or molybdenum.