A shadow mask having two or more levels of openings enables selective step coverage of micro-fabricated structures within a micro-optical bench device. The shadow mask includes a first opening within a top surface of the shadow mask and a second opening within the bottom surface of the shadow mask. The second opening is aligned with the first opening and has a second width less than a first width of the first opening. An overlap between the first opening and the second opening forms a hole within the shadow mask through which selective coating of micro-fabricated structures within the micro-optical bench device may occur.

A construction method for 3D micro/nanostructure, comprising: Step (1), fixing and vacuuming a material source on a substrate; Step (2), focusing an electron beam to ensure that a position of a focus is 0-100 nm away from a surface of material source, and an interface local domain including the focus of electron beam and surface atoms is formed; and Step (3), controlling the focus of electron beam to move point by point according to a shape of a designed 3D micro/nanostructure, and realizing the construction of 3D micro/nanostructure. This disclosure realizes real-time construction of 3D micro/nanostructure through the migration of atoms driven by uneven atomic density and electric potential difference in interface local domain. This disclosure promotes integrative development of nanotechnology and 3D printing and has good value of application and promotion.

A method for printing a structure, the structure including a plurality of pillars. The method for printing can include ejecting only a first drop of a print material such as a liquid metal sequentially at each of a plurality of pillar locations, then ejecting only a second drop of the print material sequentially onto the first drop at each of the plurality of print locations. Additional drops can be ejected at two or more of the pillar locations to form the plurality of pillars. Ejecting only a first drop at each pillar location allows the first drop to cure (i.e., cool or dry) before ejecting the second drop. The printer continues printing while the drops cure, thus improving processing efficiency and increasing production throughput.

A method for fabricating a microfluidic device includes providing an assembly that includes a first silicon substrate having a hydrophilic silicon oxide top surface that includes a microfluidic channel and a second silicon substrate having a hydrophilic silicon oxide bottom surface directly bonded on the top surface of the first silicon substrate, the second silicon substrate including fluidic access holes giving fluidic access to the microfluidic channel. The method also includes exposing the assembly to oxidative species including one or more oxygen atoms and to heat so as to form silicon oxide at a surface of the access holes and of the microfluidic channel.

A method for printing a structure, the structure including a plurality of pillars. The method for printing can include ejecting only a first drop of a print material such as a liquid metal sequentially at each of a plurality of pillar locations, then ejecting only a second drop of the print material sequentially onto the first drop at each of the plurality of print locations. Additional drops can be ejected at two or more of the pillar locations to form the plurality of pillars. Ejecting only a first drop at each pillar location allows the first drop to cure (i.e., cool or dry) before ejecting the second drop. The printer continues printing while the drops cure, thus improving processing efficiency and increasing production throughput.

A shadow mask having two or more levels of openings enables selective step coverage of micro-fabricated structures within a micro-optical bench device. The shadow mask includes a first opening within a top surface of the shadow mask and a second opening within the bottom surface of the shadow mask. The second opening is aligned with the first opening and has a second width less than a first width of the first opening. An overlap between the first opening and the second opening forms a hole within the shadow mask through which selective coating of micro-fabricated structures within the micro-optical bench device may occur.

A shadow mask having two or more levels of openings enables selective step coverage of micro-fabricated structures within a micro-optical bench device. The shadow mask includes a first opening within a top surface of the shadow mask and a second opening within the bottom surface of the shadow mask. The second opening is aligned with the first opening and has a second width less than a first width of the first opening. An overlap between the first opening and the second opening forms a hole within the shadow mask through which selective coating of micro-fabricated structures within the micro-optical bench device may occur.

A construction method for 3D micro/nanostructure, comprising: Step (1), fixing and vacuuming a material source on a substrate; Step (2), focusing an electron beam to ensure that a position of a focus is 0-100 nm away from a surface of material source, and an interface local domain including the focus of electron beam and surface atoms is formed; and Step (3), controlling the focus of electron beam to move point by point according to a shape of a designed 3D micro/nanostructure, and realizing the construction of 3D micro/nanostructure. This disclosure realizes real-time construction of 3D micro/nanostructure through the migration of atoms driven by uneven atomic density and electric potential difference in interface local domain. This disclosure promotes integrative development of nanotechnology and 3D printing and has good value of application and promotion.

A method includes forming a dielectric layer on a carrier wafer with a top surface and a bottom surface, wherein the top surface is positioned opposite to the bottom surface. The method includes forming a cleave layer on the dielectric layer that covers the top surface of the carrier wafer. Method includes forming a silicon Oxide layer (SiO.sub.2) over the cleave layer and coupling the Si layer to a handle wafer, wherein the handle wafer comprises silicon and wherein the handle wafer includes at least one cavity, wherein the Si layer encloses the at least one cavity. The method includes separating the carrier wafer from the handle wafer, wherein the separating forms a first wafer and a second wafer, wherein the first wafer comprises the handle wafer and the Si layer and a portion of the cleave layer, and wherein the second wafer is a reusable carrier wafer.

A method for fabricating a microfluidic device includes providing an assembly that includes a first silicon substrate having a hydrophilic silicon oxide top surface that includes a microfluidic channel and a second silicon substrate having a hydrophilic silicon oxide bottom surface directly bonded on the top surface of the first silicon substrate, the second silicon substrate including fluidic access holes giving fluidic access to the microfluidic channel. The method also includes exposing the assembly to oxidative species including one or more oxygen atoms and to heat so as to form silicon oxide at a surface of the access holes and of the microfluidic channel.