In one example, an electronic device can comprise (a) a first substrate comprising a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate top side, (d) a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect. Other examples and related methods are also disclosed herein.

Provided is an inexpensive microneedle array with little dimensional error that can control, with high precision, the amount of a predetermined component to be introduced to the inner part of the skin, and a production method for this microneedle array. A foundation that is insoluble or sparingly soluble in inner part of the skin is overlaid on a mold. A plurality of frustum-shaped protrusions, which are insoluble or sparingly soluble in the raw material liquid, provided on a first main surface of the foundation are fit into a plurality of cone-shaped recesses. The raw material liquid in the plurality of cone-shaped recesses dries and, as a result, a plurality of microneedles, which are dissolvable in the inner part of the skin, are fixed to tip surfaces of the plurality of frustum-shaped protrusions.

A sensor comprising a support and a flexible structure arranged on the support is provided. The flexible structure comprises a frustum-shaped portion having a wider end and a narrower end, wherein the wider end of the frustum-shaped portion is arranged proximal to the support, and an elongated portion extending from the narrower end of the frustum-shaped portion, wherein the flexible structure further comprises a stretchable conducting film arranged on the frustum-shaped portion. A method of preparing such a sensor is also provided.

A microfluidic chip includes a flow passage plate, a flat plate, and an annular seal. In the flow passage plate, a recess forming a flow passage for liquid and a communication hole communicating with the recess are formed. The flat plate is stacked on or under the flow passage plate to close the recess for defining the flow passage. In the flat plate, a communication through-hole communicating with the recess is formed. The annular seal is located on, or formed on, an outer surface of at least one of the flow passage plate and the flat plate, the annular seal surrounding at least one of the communication hole and the communication through-hole. The annular seal is made of an elastomer.

A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.

The present invention relates to a method for producing a molded body (10), comprising the following steps: a) providing a molding tool (40) which has at least one receptacle (12) in which at least one material (30) which comprises at least one shape-memory material (31) is introduced, wherein the shape-memory material (31) is present in a first state (111), wherein the material (30) at least partially fills the receptacle (12) of the molding tool (40) in such a manner that said material adjoins at least one surface of the receptacle (12); b) creating a molded body (10) in the receptacle (12) of the molding tool (40) from the material (30), wherein the shape-memory material (31) is present in a second state (112), wherein a form (11) is embossed into the molded body (10) during the second state (112); c) transferring the shape-memory material (31) to a third state (113), wherein the molded body (10) can be deformed during the third state (113) in such a manner that the molded body (10) is demolded from the receptacle (12) of the molding tool (40); and d) at least partially restoring the form (11) of the molded body (10) by transferring the shape-memory material (31) to a fourth state (114), wherein the molded body (10) at least partially resumes the form (11) according to step b) during the fourth state (114).

In a method for manufacturing a micro vibration body having a three-dimensional curved surface, a mold defining a recess part is prepared, and a plate-shaped reflow material is arranged on the mold so as to cover the recess part. Pressure of a space defined by the recess part covered with the reflow material is reduced, and the reflow material is deformed by heating from an upper surface side opposite to a lower surface facing the recess part and by means of the pressure reduced. When the reflow material is deformed, a part of the mold is heated and / or cooled. As another example, when the reflow material is deformed, a mold having a different heat capacity portion is used to generate a temperature gradient in the mold.

A method of manufacturing a fluidic device includes molding either one of the base member and the valve part with a first mold; and molding the other one of the base member and the valve part with a second mold with respect to the molded base member or the molded valve part.

A method for large scale integration of haptic devices is described. The method comprises forming a first elastomer layer of a large scale integration (LSI) device on a substrate according to a specified manufacturing process, the first elastomer layer having a plurality of fluid based circuits, the first elastomer layer adhering to a plurality of formation specifications. The method further comprises curing the first elastomer layer. Additionally, one or more additional elastomer layers of the LSI device are formed with the first elastomer layer according to the specified manufacturing process, the one or more additional elastomer layers having a plurality of fluid based circuits, the one or more additional elastomer layers adhering to the plurality of formation specifications.

A method for fabricating three-dimensional microstructures is presented. The method includes: disposing a substantially planar reflow material between two molds; heating the reflow material while the reflow material is disposed between the two molds; and reflowing the reflow material towards the bottom surface of one of the molds by creating a pressure gradient across the reflow material. At least one of molds includes geometrics features that help to shape the reflow material and thereby form a complex three-dimensional microstructure.