Embodiments disclosed are systems and methods for fabricating microchannels in metal. In an embodiments, a method includes providing a first metallic plate having a first surface with an elongated slot recessed therein, providing a second metallic plate having a second surface, interfacing the first surface of the first metallic plate with the second surface of the second metallic plate with the second surface covering the elongated slot to form a microchannel between the first metallic plate and the second metallic plate, thermal bonding the first metallic plate to the second metallic plate to form a metallic body having the microchannel extending therethrough, and infiltrating the metallic body with an infiltrant.

A system includes a semiconductor substrate having a first cavity. The semiconductor substrate forms a pedestal adjacent the first cavity. A device overlays the pedestal and is bonded to the semiconductor substrate by metal within the first cavity. A plurality of second cavities are formed in a surface of the pedestal beneath the device, wherein the second cavities are smaller than the first cavity. In some of these teachings, the second cavities are voids. In some of these teachings, the metal in the first cavity comprises a eutectic mixture. The structure relates to a method of manufacturing in which a layer providing a mask to etch the first cavity is segmented to enable easy removal of the mask-providing layer from the area over the pedestal.

A method for manufacturing a microelectronic device with a membrane suspended above at least one final cavity, may involve providing a supporting substrate having at least one elementary cavity, and a donor substrate. The method may include assembling the supporting and donor substrate, then thinning the donor substrate so as to form the membrane. Advantageously, the method may include forming at least one membrane anchoring pillar. After the forming of the at least one anchoring pillar, and after the assembling, the method may include etching the surface layer of the supporting substrate so as to widen the at least one elementary cavity, to form the final cavity, the etching being configured to selectively etch the surface layer with respect to the anchoring pillar.

A described example includes: a MEMS component on a device side surface of a first semiconductor substrate; a second semiconductor substrate bonded to the device side surface of the first semiconductor substrate by a first seal patterned to form sidewalls that surround the MEMS component; a third semiconductor substrate having a second seal extending from a surface and bonded to the backside surface of the first semiconductor substrate by the second seal, the second seal forming sidewalls of a gap beneath the MEMS component. A trench extends through the first semiconductor substrate and at least partially surrounds the MEMS component. The third semiconductor substrate is mounted on a package substrate. A bond wire or ribbon bond couples the bond pad to a conductive lead on the package substrate; and mold compound covers the MEMS component, the bond wire, and a portion of the package substrate.

A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.

A method of manufacturing a component having a microfluidic structure, comprising embossing recesses in an embossed lacquer layer, partially curing the embossed lacquer layer, sealing the recesses with a curable bonding lacquer layer, and curing the partially cured embossing lacquer layer and the bonding lacquer layer, as well as a component obtainable by the method and the use of the component.

A contact lens. The contact lens comprises an acceleration sensor for detecting a structure-borne sound produced by a wearer of the contact lens.

Compression cold welding methods, joint structures, and hermetically sealed containment devices are provided. The method includes providing a first substrate having at least one first joint structure which comprises a first joining surface, which surface comprises a first metal; providing a second substrate having at least one second joint structure which comprises a second joining surface, which surface comprises a second metal; and compressing together the at least one first joint structure and the at least one second joint structure to locally deform and shear the joining surfaces at one or more interfaces in an amount effective to form a metal-to-metal bond between the first metal and second metal of the joining surfaces. Overlaps at the joining surfaces are effective to displace surface contaminants and facilitate intimate contact between the joining surfaces without heat input. Hermetically sealed devices can contain drug formulations, biosensors, or MEMS devices.

Representative implementations of techniques and devices provide seals for sealing the joints of bonded microelectronic devices as well as bonded and sealed microelectronic assemblies. Seals are disposed at joined surfaces of stacked dies and wafers to seal the joined surfaces. The seals may be disposed at an exterior periphery of the bonded microelectronic devices or disposed within the periphery using the various techniques.

A method for manufacturing a microelectronic device with a membrane suspended above at least one final cavity, may involve providing a supporting substrate having at least one elementary cavity, and a donor substrate. The method may include assembling the supporting and donor substrate, then thinning the donor substrate so as to form the membrane. Advantageously, the method may include forming at least one membrane anchoring pillar. After the forming of the at least one anchoring pillar, and after the assembling, the method may include etching the surface layer of the supporting substrate so as to widen the at least one elementary cavity, to form the final cavity, the etching being configured to selectively etch the surface layer with respect to the anchoring pillar.