A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.

Substrate is produced by using a MEMS technique to form multiple diaphragms in a substrate by forming piezoelectric material layer on one surface of the substrate and thereafter by forming openings in the substrate from the other surface of the substrate; substrate and substrate on which signal detection circuit is formed are aligned to each other using at least one of multiple diaphragms as alignment diaphragm; and substrate and substrate are bonded together.

A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.

A self-cleaning sensor to determine a level of a liquid includes a tube with an interior coating and a plurality of horizontally aligned, electrically isolated, electrical contacts. The self-cleaning sensor includes the plurality of horizontally aligned, electrically isolated, electrical contacts that each terminate in an outer surface of an interior wall of the tube and are electrically connected to one or more electrical devices in a cap residing on the tube. Additionally, the self-cleaning sensor includes a float that is composed of a low density, low dielectric constant material buoyant in one or more liquids to be measured where each horizontal dimension of the float corresponds to each horizontal dimension of the tube.

A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.

A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.

A self-cleaning sensor to determine a level of a liquid includes a tube with an interior coating and a plurality of horizontally aligned, electrically isolated, electrical contacts. The self-cleaning sensor includes the plurality of horizontally aligned, electrically isolated, electrical contacts that each terminate in an outer surface of an interior wall of the tube and are electrically connected to one or more electrical devices in a cap residing on the tube. Additionally, the self-cleaning sensor includes a float that is composed of a low density, low dielectric constant material buoyant in one or more liquids to be measured where each horizontal dimension of the float corresponds to each horizontal dimension of the tube.

Substrate is produced by using a MEMS technique to form multiple diaphragms in a substrate by forming piezoelectric material layer on one surface of the substrate and thereafter by forming openings in the substrate from the other surface of the substrate; substrate and substrate on which signal detection circuit is formed are aligned to each other using at least one of multiple diaphragms as alignment diaphragm; and substrate and substrate are bonded together.

A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.