The mirror group is formed by a monolithic frame bent along a bending line and including a first and a second supporting portions carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions are arranged on opposite sides of the bending line of the frame, angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.

Systems and methods which operate to reserve an amount of value associated with a value bearing indicia (VBI) request or requests are shown. Embodiments facilitate completion of a multiple VBI session without failing due to insufficient value balance once the session has begun. Additionally or alternatively, embodiments facilitate later or subsequent (e.g., scheduled) completion of a VBI session, whether a session for a single VBI or multiple VBI, without failing due to insufficient value balance. Value reservations may be made automatically and/or manually. Embodiments provide various reservation priority levels, such as to individual users, user groups, user systems, sessions, types of sessions, jobs, etc., in order to facilitate completion of various desired operations without failure due to insufficient value. Value reservation techniques according to embodiments do not introduce additional transactions into a normal VBI session flow.

The mirror group is formed by a monolithic frame bent along a bending line and including a first and a second supporting portions carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions are arranged on opposite sides of the bending line of the frame, angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.

MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.