A transfer system for transferring multiple microelements to a receiving substrate includes a main pick-up device, a testing device, and first and second carrier plates. The testing device includes a testing platform, a testing circuit, and multiple testing electrodes electrically connected to the testing circuit. The main pick-up device is operable to releasably pick up the microelements from the first carrier plate and position the microelements on the testing electrodes. The testing device is operable to test the microelements to distinguish unqualified ones of the microelements from qualified ones. The main pick-up device is operable to release the qualified ones of the microelements to the receiving substrate.

The invention relates to a method for producing a structure with spatial encoded functionality, the method comprising: providing in a volume (114) a first photosensitive material (116) that is two-photon crosslinking compatible, generating in the volume (114) a framework of crosslinked first photo-sensitive material (116), the generating of the framework comprising exposing the first photosensitive material (116) with a first focused laser beam (118) according to a first pattern for specifically initiating a two-photon crosslinking of the first photosensitive material (116) in accordance with the first pattern, removing from the volume (114) any remaining non-crosslinked portions of the first photosensitive material (116), providing to the volume (114) a second photosensitive material (116) that is two-photon crosslinking compatible, generating in the volume (114) the structure, the generating of the structure comprising exposing the second photosensitive material (116) with a second focused laser beam (118) according to a second pattern for specifically initiating a two-photon crosslinking of predefined surface portions of the framework and the second photosensitive material (116) in accordance with the second pattern, removing from the volume (114) any remaining non-crosslinked portions of the second photosensitive material (116).

A method includes obtaining an active feature layer having a first surface bearing one or more active feature areas. A first capacitor plate of a first capacitor is formed on an interior surface of a cap. A second capacitor plate of the first capacitor is formed on an exterior surface of the cap. The first capacitor plate of the first capacitor overlays and is spaced apart from the second capacitor plate of the first capacitor along a direction that is orthogonal to the exterior surface of the cap to form the first capacitor. The cap is coupled with the first surface of the active feature layer such that the second capacitor plate of the first capacitor is in electrical communication with at least a first active feature of the active feature layer. The cap is bonded with the passive layer substrate.

A method for manufacturing a microfluidic device can include providing a base component to define a first portion of the microfluidic device. A cap component of the microfluidic device can be fabricated with a sealing lip extending a first distance from a first side of the cap component and a support portion extending a second distance, less than the first distance, from the first side of the cap component. The method can include positioning the cap component and the base component within a mold to bring the sealing lip of the cap component in contact with the base component. The base component, the support portion of the cap component, and the sealing lip of the cap component together can define a cavity. The method can include injecting a polymer material into the mold to cause the polymer material to fill the cavity.

A method includes obtaining an active feature layer having a first surface bearing one or more active feature areas. A first capacitor plate of a first capacitor is formed on an interior surface of a cap. A second capacitor plate of the first capacitor is formed on an exterior surface of the cap. The first capacitor plate of the first capacitor overlays and is spaced apart from the second capacitor plate of the first capacitor along a direction that is orthogonal to the exterior surface of the cap to form the first capacitor. The cap is coupled with the first surface of the active feature layer such that the second capacitor plate of the first capacitor is in electrical communication with at least a first active feature of the active feature layer. The cap is bonded with the passive layer substrate.

Disclosed herein is a microelectrode platform that may be used for multiple biosystem applications including cell culturing techniques and biosensing. Also disclosed are microfabrication techniques for inexpensively producing microelectrode platforms.

A method includes: providing a first substrate on which a plurality of first semiconductor devices is formed; providing a second substrate on which a plurality of second semiconductor devices is formed; and coupling the first and second substrates by contacting respective dummy pads of the first and second substrates, wherein at least one of the dummy pads of the first and second substrates comprises plural peaks and valleys.

A component source wafer comprises printable components having adhesive disposed on a backside of the printable components. A wafer substrate comprises a sacrificial layer having recessed portions and anchors. A component is disposed entirely over each recessed portion. A tether physically connects each component to at least one of the anchors. A layer of adhesive is disposed on a side of the component adjacent to the recessed portion. Each component is suspended over the wafer substrate and the recessed portion defines a gap separating the component from the wafer substrate.

Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.

A method includes: providing a first substrate on which a plurality of first semiconductor devices is formed; providing a second substrate on which a plurality of second semiconductor devices is formed; and coupling the first and second substrates by contacting respective dummy pads of the first and second substrates, wherein at least one of the dummy pads of the first and second substrates comprises plural peaks and valleys.