A mold with a multi-layer coating is disclosed. The mold may include a mold body having an outer surface and a multi-layer coating disposed on the outer surface. The multi-layer coating may include a diffusion barrier layer disposed on the outer surface of the mold body and an intermetallic layer disposed on the diffusion barrier layer, wherein the intermetallic layer comprises Ti, Al, and an additional metal selected from the group consisting of Zr, Ta, Nb, Y, Mo, Hf, and combinations thereof. The diffusion barrier layer may restrict diffusion of metal from the mold body to the intermetallic layer.

An intermediate layer forming method to form an intermediate layer formed between a base material and a DLC film using a PVD method includes: a Ti layer film-forming step of film-forming a Ti layer on a base material; and a TiC layer film-forming step of film-forming a TiC layer on the Ti layer, in which in the Ti layer film-forming step, an Ar gas is supplied into a chamber into which the base material is carried and a film-forming pressure is set to a pressure in a range of not less than 0.4 Pa and not more than 1 Pa to film-form the Ti layer, and in the TiC layer film-forming step, an Ar gas and a CH.sub.4 gas are supplied into the chamber, a film-forming pressure is set to a pressure in a range of 0.2 Pa or more to less than 0.4 Pa, and a second bias voltage higher in bias voltage than a first bias voltage applied to the base material in the Ti layer film-forming step and higher in bias voltage than 100 V is applied to the base material to film-form the TiC layer.

A mold with a multi-layer coating is disclosed. The mold may include a mold body having an outer surface and a multi-layer coating disposed on the outer surface. The multi-layer coating may include a diffusion barrier layer disposed on the outer surface of the mold body and an intermetallic layer disposed on the diffusion barrier layer, wherein the intermetallic layer comprises Ti, Al, and an additional metal selected from the group consisting of Zr, Ta, Nb, Y, Mo, Hf, and combinations thereof The diffusion barrier layer may restrict diffusion of metal from the mold body to the intermetallic layer.