Disclosed herein are glass-based articles having a first surface having an edge, wherein a maximum optical retardation of the first surface is at the edge and the maximum optical retardation is less than or equal to about 40 nm and wherein the optical retardation decreases from the edge toward a central region of the first surface, the central region having a boundary defined by a distance from the edge toward a center point of the first surface, wherein the distance is ½ of the shortest distance from the edge to the center point.

A ceramic glass for cooktop includes a glass material having an uneven layer formed on an upper surface of the glass material. A color difference meter value L of the ceramic glass ranges from 90 to 100. The glass material includes Li.sub.2O, Al.sub.2O.sub.3, and SiO.sub.2. A heat shock temperature of the ceramic glass ranges from 525° C. to 575° C. The ceramic glass implements a surface roughness Ra of 0.1 μm or less and surface roughness Rz of 0.8 μm or less through a polishing operation. The surface roughness Ra corresponds to an average length between at least one peak of the uneven layer and at least one valley of the uneven layer. The surface roughness Rz corresponds to a vertical distance between the at least one peak of the uneven layer and the at least one valley of the uneven layer.

A ceramic glass for cooktop includes a glass material having an uneven layer formed on an upper surface of the glass material. A color difference meter value L of the ceramic glass ranges from 90 to 100. The glass material includes Li.sub.2O, Al.sub.2O.sub.3, and SiO.sub.2. A heat shock temperature of the ceramic glass ranges from 525° C. to 575° C. The ceramic glass implements a surface roughness Ra of 0.1 μm or less and surface roughness Rz of 0.8 μm or less through a polishing operation. The surface roughness Ra corresponds to an average length between at least one peak of the uneven layer and at least one valley of the uneven layer. The surface roughness Rz corresponds to a vertical distance between the at least one peak of the uneven layer and the at least one valley of the uneven layer.

A rear cover of an electronic device is provided. The rear cover includes a glass substrate including a first face facing a first direction, a second face facing a second direction opposite to the first direction, and at least one side face disposed between the first face and the second face, a roughness layer formed on the first face and having a first roughness, a hairline pattern formed on the roughness layer and having a second roughness, and a hard coating layer formed on the roughness layer and the hairline pattern.

According to various embodiments, a back surface plate configured to form a back surface of an electronic device may include: a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and a second glass part, at least a portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area, wherein the second glass part may have a color different from the color of the first glass part.

A glass part includes a substrate and a texture reinforcement layer disposed on at least one surface of the substrate. The texture reinforcement layer includes a plurality of reinforcement units. Cross sections of an outer surface of each reinforcement unit in at least a horizontal direction and a vertical direction are in a hyperbolic shape or a parabolic shape.

A processing fixture can be employed for processing a glass cover plate and include: a fixture body, a first sensing component, a roller component, and a control module connected with the first sensing component. The fixture body is made from flexible materials and provided with a positioning groove matched with shape of an outer surface of the glass cover plate. The first sensing component is configured to detect current dimension parameter of the glass cover plate and/or an attaching layer attached to the glass cover plate in the positioning groove, and transmit the detected current dimension parameter to the control module. The control module is configured to control cooperation of the roller component and the fixture body according to the current dimension parameter, so as to correct the current dimension parameter of the glass cover plate or the attaching layer as a target dimension parameter.

A method for shaping a coated glass sheet involves conveying the coated glass sheet through a furnace to heat the coated glass sheet to a temperature suitable for shaping. The coated glass sheet is then deposited on a first bending tool for supporting the coated glass sheet and is at a first position relative to the first bending tool. A first portion of the coated glass sheet is contacted to move the coated glass sheet to a second position relative to the first bending tool. The coated glass sheet is then shaped on the first bending tool. Other aspects include a method for adjusting the position of a hot coated glass sheet on a bending tool and a shaping line for shaping a coated glass sheet comprising a positioning device for contacting a first portion of a coated glass sheet on a bending tool to adjust the position thereof.

The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.

The invention relates to methods of producing a cap substrate, to methods of producing a packaged radiation-emitting device at the wafer level, and to a radiation-emitting device. By producing a cap substrate, providing a device substrate in the form of a wafer including a multitude of radiation-emitting devices, arranging the substrates one above the other such that the substrates are bonded along an intermediate bonding frame, and dicing the packaged radiation-emitting devices, improved packaged radiation-emitting devices are provided which are advantageously arranged within a cavity free from organics and can be examined, still at the wafer level, in terms of their functionalities in a simplified manner prior to being diced.