According to various embodiments, a back surface plate configured to form a back surface of an electronic device may include: a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and a second glass part, at least a portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area, wherein the second glass part may have a color different from the color of the first glass part.

According to various embodiments, a back surface plate configured to form a back surface of an electronic device may include: a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and a second glass part, at least a portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area, wherein the second glass part may have a color different from the color of the first glass part.

Method and system for a laser welding process employing the use of a single pulsed fiber laser source configured to generate a radiative output with a wavelength spectrum extending from about 1.8 microns to about 2.6 microns. In a specific case, the laser output from the single pulsed fiber laser source is focused onto the interface of the two pieces of materials at least one of which includes any of glasses, inorganic crystals, and semiconductors.

Method and system for a laser welding process employing the use of a single pulsed fiber laser source configured to generate a radiative output with a wavelength spectrum extending from about 1.8 microns to about 2.6 microns. In a specific case, the laser output from the single pulsed fiber laser source is focused onto the interface of the two pieces of materials at least one of which includes any of glasses, inorganic crystals, and semiconductors.

A hollow body includes a wall which at least partially surrounds an interior volume of the hollow body. The wall comprises a layer of glass comprising a first glass composition, comprises a base surface, and has a wall surface. The wall surface comprises at least one surface region, in which the base surface is at least partially superimposed by at least one elevated region, and at least one contact region, which extends along a contact range of a height of the hollow body. The at least one elevated region comprises a further glass composition. An exterior diameter of the hollow body has a maximum throughout the contact range. The at least one surface region is at least partially positioned in the at least one contact region.

A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

A glass wafer has an internal surface and an opposing external surface separated by a wafer thickness. A hermetic, electrically conductive feedthrough extends through the wafer from the internal surface to the opposing external surface. The feedthrough includes a feedthrough member having an inner face exposed along the internal surface for electrically coupling to an electrical circuit. The feedthrough member extends from the inner face partially through the wafer thickness to an exteriorly-facing outer face hermetically embedded within the wafer.

The present invention relates to a method of joining glass elements with material continuity, to a glass component, to a housing, and to a vacuum insulating panel. The method comprises the following steps providing first and second glass elements, with each of the glass elements having at least one joining region having an outer edge to be joined, introducing a metallic material into the first glass element in the region of the joining region of the first glass element, placing the first and second glass elements onto one another such that the first and second glass elements contact one another at least at one outer edge of the respective joining region; and heating the metallic material in the first glass element so that the glass element at least partially melts in the region of the joining region of the first glass element so that a connection with material continuity is produced between the first and second glass elements.

The present invention relates to a method of joining glass elements with material continuity, to a glass component, to a housing, and to a vacuum insulating panel. The method comprises the following steps providing first and second glass elements, with each of the glass elements having at least one joining region having an outer edge to be joined, introducing a metallic material into the first glass element in the region of the joining region of the first glass element, placing the first and second glass elements onto one another such that the first and second glass elements contact one another at least at one outer edge of the respective joining region; and heating the metallic material in the first glass element so that the glass element at least partially melts in the region of the joining region of the first glass element so that a connection with material continuity is produced between the first and second glass elements.

Various embodiments comprise a laser bonded glass-silicon vapor cell for performing spectroscopy on particles like atoms or molecules. In some examples, the laser bonded glass-silicon vapor cell comprises a glass base, a glass top, a silicon piece, and a filling material. The silicon piece comprises at least one through hole. The lower surface of the silicon piece is hermetically bonded to the glass base. The upper surface of the silicon piece is laser bonded to the glass top. The filling material is positioned in a cavity formed by the through hole, the glass base, and the glass top. The filling material may comprise an alkali metal, a salt slush, an inert gas, or a vacuum encapsulation.