Patent classifications
C03B33/07
Thin-film devices and fabrication
Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.
Manufacture of laminated glazing
A process for manufacturing a bent laminated glazing, includes manufacturing a first bent laminated glazing including at least two glass substrates locally comprising, in each of the at least two glass substrates and facing each other in all the at least two glass substrates, a zone including compressive stresses, and cutting the first bent laminated glazing through its entire thickness along a line included in the zone in order to form local cut edges and, after cutting, a second bent laminated glazing with the local cut edges having compressive edge stresses.
CUTTING METHOD AND CUTTING DEVICE FOR SCORING COMPONENTS MADE OF GLASS OR CERAMIC, AND METHOD FOR SPLITTING COMPONENTS MADE OF GLASS OR CERAMIC
The present invention relates to a cutting method and a cutting device for the superficial scoring of, preferably plate-shaped, components made of glass or ceramics, preferably of glass sheets, and to a method for dividing of, preferably plate-shaped, components made of glass or ceramics, preferably of glass sheets, for example of float glass sheets or laminated glass sheets, in particular laminated safety glass sheets, into individual component cuttings, preferably glass sheet cuttings.
METHOD OF CUTTING COMBINED STRUCTURE OF GLASS SUBSTRATE AND LIGHT-ABSORBING PLATE
A method of cutting a combined structure of a glass substrate and a light absorbing plate includes providing a glass substrate on a metal plate, providing a light absorbing material at an edge of the glass substrate, and cutting the glass substrate and the light absorbing plate by irradiating a laser beam to the glass substrate from the edge to which the light absorbing material is provided.
METHOD OF CUTTING COMBINED STRUCTURE OF GLASS SUBSTRATE AND LIGHT-ABSORBING PLATE
A method of cutting a combined structure of a glass substrate and a light absorbing plate includes providing a glass substrate on a metal plate, providing a light absorbing material at an edge of the glass substrate, and cutting the glass substrate and the light absorbing plate by irradiating a laser beam to the glass substrate from the edge to which the light absorbing material is provided.
Low warp fan-out processing method and production of substrates therefor
A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion α.sub.core, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion α.sub.clad, where α.sub.clad>α.sub.core; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.
APPARATUS AND METHOD FOR CUTTING GLASS LAMINATE
Provided are an apparatus and method for cutting a glass laminate The apparatus comprises a first and second part spaced apart from each other by a first gap, a first guide block and a second guide block spaced apart from each other by a second gap, wherein a saw blade is able to pass through first and second gaps, a first fixing unit and second fixing unit, each capable of fixing the respective first guide block and second guide block to the respective first part and second part of the table, and thus defining a space for a glass laminate.
APPARATUS AND METHOD FOR CUTTING GLASS LAMINATE
Provided are an apparatus and method for cutting a glass laminate The apparatus comprises a first and second part spaced apart from each other by a first gap, a first guide block and a second guide block spaced apart from each other by a second gap, wherein a saw blade is able to pass through first and second gaps, a first fixing unit and second fixing unit, each capable of fixing the respective first guide block and second guide block to the respective first part and second part of the table, and thus defining a space for a glass laminate.
LOW WARP FAN-OUT PROCESSING METHOD AND PRODUCTION OF SUBSTRATES THEREFOR
A method of fan-out processing includes providing or obtaining a fused glass laminate sheet or wafer having a core layer and a first clad layer and a second clad layer, the core layer comprising a core glass having a core glass coefficient of thermal expansion α.sub.core, the first clad layer and the second clad layer each comprising a clad glass having a clad glass coefficient of thermal expansion α.sub.clad, where α.sub.clad>α.sub.core; affixing integrated circuit devices to the second clad layer of the laminate sheet or wafer; forming a fan-out layer on or above the integrated circuit devices; and removing some of the first clad layer to decrease warp of the sheet or wafer with integrated circuit devices and a fan-out layer thereon. A method of producing a laminate sheet or wafer having a selected CTE is also disclosed.
Miniature, durable polarization devices
Polarizing optical devices described herein, and polarizing optical devices resulting from methods described herein, can be small and can have high heat tolerance. Wires of wire grid polarizers can be attached directly to prisms of the polarizing optical devices, allowing for small size. Multiple polarizing optical devices can be attached by adhesive-free bonding techniques, allowing high heat tolerance.