An article comprises a glass substrate. The glass substrate has a first surface having a plurality of vias therein, and a second surface parallel to the first surface. At least one of the first surface and the second surface is an etched surface having a surface roughness (Ra) of 0.75 nm or less. The glass substrate comprises, in mol percent on an oxide basis: 65 mol %≤SiO.sub.2≤75 mol %; 7 mol %≤Al.sub.2O.sub.3≤15 mol %; 26.25 mol %≤RO+Al.sub.2O.sub.3−B.sub.2O.sub.3; 0 mol %≤R.sub.2O≤2 mol %. RO=MgO+CaO+SrO+BaO+ZnO. R.sub.2O=Li.sub.2O+Na.sub.2O+K.sub.2O+Rb.sub.2O+Cs.sub.2O.

An article comprises a glass substrate. The glass substrate has a first surface having a plurality of vias therein, and a second surface parallel to the first surface. At least one of the first surface and the second surface is an etched surface having a surface roughness (Ra) of 0.75 nm or less. The glass substrate comprises, in mol percent on an oxide basis: 65 mol %≤SiO.sub.2≤75 mol %; 7 mol %≤Al.sub.2O.sub.3≤15 mol %; 26.25 mol %≤RO+Al.sub.2O.sub.3−B.sub.2O.sub.3; 0 mol %≤R.sub.2O≤2 mol %. RO=MgO+CaO+SrO+BaO+ZnO. R.sub.2O=Li.sub.2O+Na.sub.2O+K.sub.2O+Rb.sub.2O+Cs.sub.2O.

Methods for strengthening edges of a laminated glass article comprising a glass core layer positioned between a first glass clad layer and a second glass clad layer are disclosed. The methods may comprise polishing the cut edges of the laminated glass article with a slurry of polishing media applied to the edges of the laminated glass article with brushes. An edge strength of the laminated glass article is greater than or equal to about 400 MPa after polishing.

Methods for strengthening edges of a laminated glass article comprising a glass core layer positioned between a first glass clad layer and a second glass clad layer are disclosed. The methods may comprise polishing the cut edges of the laminated glass article with a slurry of polishing media applied to the edges of the laminated glass article with brushes. An edge strength of the laminated glass article is greater than or equal to about 400 MPa after polishing.

A sealed pharmaceutical container includes a shoulder, a neck extending from the shoulder, and a flange extending from the neck. The flange includes an inclined sealing surface defining an opening in the sealed pharmaceutical container. The sealed pharmaceutical container also includes a sealing assembly including a stopper extending over the sealing surface of the flange and a cap securing the stopper to the flange. The stopper has a glass transition temperature (T.sub.g) that is greater than or equal to −70° C. and less than or equal to −45° C. The sealing assembly maintains a helium leakage rate of the sealed pharmaceutical container of less than or equal to 1.4×10.sup.−6 cm.sup.3/s as the sealed pharmaceutical container is cooled to a temperature of less than or equal to −45° C.

A sealed pharmaceutical container includes a shoulder, a neck extending from the shoulder, and a flange extending from the neck. The flange includes an inclined sealing surface defining an opening in the sealed pharmaceutical container. The sealed pharmaceutical container also includes a sealing assembly including a stopper extending over the sealing surface of the flange and a cap securing the stopper to the flange. The stopper has a glass transition temperature (T.sub.g) that is greater than or equal to −70° C. and less than or equal to −45° C. The sealing assembly maintains a helium leakage rate of the sealed pharmaceutical container of less than or equal to 1.4×10.sup.−6 cm.sup.3/s as the sealed pharmaceutical container is cooled to a temperature of less than or equal to −45° C.

A method of Bessel beam laser processing for forming through glass vias is adapted for processing a glass substrate having a thickness of less than or equal to 1000 micrometers. The glass substrate is processed by a Bessel beam laser to form a pilot through via and is etched to enlarge the pilot through via to form a through glass via having a diameter ranging from 25 micrometers to 200 micrometers. The Bessel beam laser has a pulse width ranging from 10 picoseconds to 20 picoseconds and is converted as a Bessel beam passing through the glass substrate to form the pilot through via. The through glass via with a smooth interior surface is formed.

A method of Bessel beam laser processing for forming through glass vias is adapted for processing a glass substrate having a thickness of less than or equal to 1000 micrometers. The glass substrate is processed by a Bessel beam laser to form a pilot through via and is etched to enlarge the pilot through via to form a through glass via having a diameter ranging from 25 micrometers to 200 micrometers. The Bessel beam laser has a pulse width ranging from 10 picoseconds to 20 picoseconds and is converted as a Bessel beam passing through the glass substrate to form the pilot through via. The through glass via with a smooth interior surface is formed.

A property-enhanced cover sheet, and methods for forming a property-enhanced cover sheet, for a portable electronic device are disclosed. A property-enhanced cover sheet is formed by thermoforming a glass sheet into a specified contour shape while modifying one or more properties of the glass. Other property-enhanced sheets can be formed by layering two or more glass sheets having different material properties, and then thermoforming the layered sheets into a required contour shape. Property enhancement for a cover sheet includes, hardness, scratch resistance, strength, elasticity, texture and the like.

A property-enhanced cover sheet, and methods for forming a property-enhanced cover sheet, for a portable electronic device are disclosed. A property-enhanced cover sheet is formed by thermoforming a glass sheet into a specified contour shape while modifying one or more properties of the glass. Other property-enhanced sheets can be formed by layering two or more glass sheets having different material properties, and then thermoforming the layered sheets into a required contour shape. Property enhancement for a cover sheet includes, hardness, scratch resistance, strength, elasticity, texture and the like.