Patent classifications
C03C17/3602
Method of fabricating a metal thin film supported by a glass support
A method of fabricating a metal thin film-on-glass structure. A glass substrate, on a top surface of which a layer is formed, is prepared. A local area of the glass substrate is etched from a bottom of the glass substrate to expose the layer downwardly, thereby forming an exposed area of the layer. The layer is a metal thin film. The etching includes first-etching the glass substrate to a depth less than a thickness of the glass substrate using a first etching solution containing hydrofluoric acid and at least one of nitric acid and sulfuric acid, resulting in a first-etched portion of the glass substrate; and second-etching the first-etched portion of the glass substrate using an etching solution containing hydrofluoric acid without nitric acid or sulfuric acid, so that the layer is exposed downwardly, whereby the metal thin film is supported by a remaining portion of the glass substrate.
MASK BLANK SUBSTRATE, MASK BLANK, AND METHODS FOR MANUFACTURING THEM, METHOD FOR MANUFACTURING TRANSFER MASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
The object is to provide a mask blank substrate, a mask blank, and a transfer mask which can achieve easy correction of a wavefront by a wavefront correction function of an exposure apparatus. The further object is to provide methods for manufacturing them.
A virtual surface shape, which is an optically effective flat reference surface shape defined by a Zernike polynomial, is determined, wherein the Zernike polynomial is composed of only terms in which the order of variables related to a radius is second or lower order and includes one or more terms in which the order of the variables related to a radius is second-order; and the mask blank substrate, in which difference data (PV value) between the maximum value and the minimum value of difference shape between a virtual surface shape and a composite surface shape obtained by composing respective surface shapes of two main surfaces is 25 nm or less, is selected.
Materials and methods for passivation of metal-plated through glass vias
A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal-nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.
METHOD OF FABRICATING METAL THIN FILM SUPPORTED BY GLASS SUPPORT
A method of fabricating a metal thin film-on-glass structure. A glass substrate, on a top surface of which a layer is formed, is prepared. A local area of the glass substrate is etched from a bottom of the glass substrate to expose the layer downwardly, thereby forming an exposed area of the layer. The layer is a metal thin film. The etching includes first-etching the glass substrate to a depth less than a thickness of the glass substrate using a first etching solution containing hydrofluoric acid and at least one of nitric acid and sulfuric acid, resulting in a first-etched portion of the glass substrate; and second-etching the first-etched portion of the glass substrate using an etching solution containing hydrofluoric acid without nitric acid or sulfuric acid, so that the layer is exposed downwardly, whereby the metal thin film is supported by a remaining portion of the glass substrate.
ENERGY-SAVING GLASS AND METHOD OF MANUFACTURING THE SAME
An energy-saving glass includes a glass substrate, and a periodic metal layer deposited on the glass substrate and having a honeycomb array of round holes. A method of manufacturing the energy-saving glass includes: providing a template having multiple template spots arranged in a honeycomb array; forming on the template a transfer metal layer having multiple metal spots disposed respectively on the template spots; transferring the metal spots onto a photoresist layer on a glass substrate; etching the photoresist layer exposed from the metal spots to leave photoresist spots underlying the metal spots on the glass substrate; forming a periodic metal layer around the photoresist spots; and removing the photoresist spots.
IG WINDOW UNIT HAVING TRIPLE SILVER COATING AND DIELECTRIC COATING ON OPPOSITE SIDES OF GLASS SUBSTRATE
An insulating glass (IG) window unit including first and second glass substrates that are spaced apart from each other. At least one of the glass substrate has a triple silver low-emissivity (low-E) coating on one major side thereof, and a dielectric coating for improving angular stability on the other major side thereof
Materials and Methods for Passivation of Metal-Plated Through Glass Vias
A through-glass via (TGV) formed in a glass substrate may comprise a metal plating layer formed in the TGV. The TGV may have a three-dimensional (3D) topology through the glass substrate and the metal plating layer conformally covering the 3D topology. The TGV may further comprise a barrier layer disposed over the metal plating layer, and a metallization layer disposed over the barrier layer. The metallization layer may be electrically coupled to the metal plating layer through the barrier layer. The barrier layer may comprise a metal-nitride film disposed on the metal plating layer that is electrically coupled to the metallization layer. The barrier layer may comprise a metal film disposed over the metal plating layer and over a portion of glass surrounding the TGV, and an electrically-insulating film disposed upon the metal film, the electrically-insulating film completely overlapping the metal plating layer and partially overlapping the metal film.
Electronic device enclosure having a textured glass component
Textured cover assemblies for electronic devices are disclosed. The textured cover assemblies may provide a combination of optical and tactile properties to the electronic devices. In some cases, a textured cover assembly may be provided over decorative coating.
METHOD FOR PRODUCING AN ELECTRONIC STRUCTURE ON A GLASS PANE AND GLASS SHEET HAVING AT LEAST ONE GLASS PANE OF THIS TYPE
A method for producing an electronic structure on a glass pane which has, at least on one of its two glass pane surfaces, a functional coating having at least one electrically conductive functional layer, preferably having multiple electrically conductive functional layers, the functional coating being structured by means of laser radiation in such a way that the electronic structure, preferably a capacitive sensor system or a conductor loop, is created. A glass sheet having at least one glass pane of this type.
IG window unit having triple silver coating and dielectric coating on opposite sides of glass substrate
An insulating glass (IG) window unit including first and second glass substrates that are spaced apart from each other. At least one of the glass substrate has a triple silver low-emissivity (low-E) coating on one major side thereof, and a dielectric coating for improving angular stability on the other major side thereof.