The present disclosure relates to a method for forming a glass structure having a metallized surface portion. The method may comprise forming a structure using a flowable first material, adapted to form a glass, which includes a metal component. The structure is then treated to remove substantially all solvents and organic components contained in the first flowable material. Finally, the structure is exposed to a bath of a metal salt during which nucleation occurs and a metallized surface coating is formed on at least a portion of an outer surface of the structure.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A hood for depositing vaporized metals on glass container surfaces includes a vaporized metal source that produces vaporized metal; an enclosure, receiving one or more glass containers, comprising at least one side wall and at least one center section having a top above the glass containers; and one or more conduits that fluidly communicate the vaporized metal to an opening in at least one of the top of the center section and the side wall using one or more conduit fans.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A hood for depositing vaporized metals on glass container surfaces includes a vaporized metal source that produces vaporized metal; an enclosure, receiving one or more glass containers, comprising at least one side wall and at least one center section having a top above the glass containers; and one or more conduits that fluidly communicate the vaporized metal to an opening in at least one of the top of the center section and the side wall using one or more conduit fans.

A method for preparing a metal layer comprising: a) preparing a liquid composition comprising at least one precursor of at least one metal, at least one solvent of the precursor and at least one photo-initiator, the concentration of the precursor being at least 0.6% by weight relative to the weight of the liquid composition; b) depositing the liquid composition on a substrate forming a liquid composition deposited on a substrate; c) irradiating with a UV, Vis and IR source the liquid composition deposited on a substrate obtained at step b) forming a metal layer comprising or consisting of the metal; d) obtaining a metal layer. The present invention also relates to a material comprising a substrate and a metal layer, the metal layer being in contact with said substrate, the metal layer consisting of particles of metal in spatial contact together thereby forming a continuous metal layer of particles.

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

An article including a glass or glass ceramic substrate, a noble metal layer, an adhesion promoting layer positioned between and bonded to the substrate and the noble metal layer, and a conductive metal layer positioned on and bonded to the noble metal layer. The adhesion promoting layer includes a siloxy group bonded with the substrate and a thiol group bonded to the noble metal layer. A method for manufacturing an article including applying an adhesion promoting layer comprising mercaptosilane to at least a portion of a glass or glass ceramic substrate, wherein siloxane bonds are formed between the mercaptosilane and the substrate, applying a noble metal layer to the adhesion promoting layer, the noble metal layer bonds with a thiol present in the mercaptosilane, thermally treating the noble metal layer, and applying a conductive metal layer to the noble metal layer.