Patent classifications
C03C2217/43
Coating agent containing clay, resin, and organic solvent, protective film using same, and product
Disclosed herein is a coating agent containing a synthetic organically-modified clay comprising a synthetic clay and an organic modification agent, a resin, and an organic solvent, wherein the organic solvent is contained in an amount within the range of 5-70 parts by weight with respect to 30 parts by weight of the resin, and contains at least two selected from the group consisting of toluene, xylene, and ethylbenzene; a protective film using the same; and a product provided with the protective film.
ARTICLES WITH PATTERNED COATINGS
Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.
Articles with patterned coatings
Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.
OBJECT WITH A HIGH-TEMPERATURE-RESISTANT OMNIPHOBIC NON-STICK COATING, AND METHOD FOR PRODUCING SUCH AN OBJECT
An object having a high temperature resistance includes an inorganic substrate, an omniphobic non-stick coating, and an adhesion-promoting coating containing amorphic silicon dioxide and located between the inorganic substrate and the omniphobic non-stick coating.
SURFACE-TREATED INFRARED ABSORBING FINE PARTICLE DISPERSION LIQUID AND INFRARED ABSORBING TRANSPARENT SUBSTRATE
A surface-treated infrared absorbing fine particle dispersion liquid wherein surface-treated infrared absorbing fine particles are dispersed in a liquid medium, and are an infrared absorbing transparent substrate having a coating layer in which the surface-treated infrared absorbing fine particles. This is a surface-treated infrared absorbing fine particle dispersion liquid in which surface ted infrared absorbing fine particles are dispersed in a liquid medium, wherein the surface-treated infrared absorbing fine particles are infrared absorbing fine particles, each surface is coated with a coating layer containing at least one selected from a hydrolysis product of a metal chelate compound, a polymer of the hydrolysis product of the metal chelate compound, a hydrolysis product of a metal cyclic oligomer compound, and a polymer of the hydrolysis product of the metal cyclic oligomer compound, and this is an infrared absorbing transparent substrate prepared using the surface-treated infrared absorbing fine particle dispersion liquid.
GOLD-COATED FLAT SILVER PARTICLES, GOLD-COATED FLAT SILVER PARTICLE DISPERSION, METHOD OF MANUFACTURING GOLD-COATED FLAT SILVER PARTICLES, COATING FILM, AND ANTIREFLECTION OPTICAL MEMBER
Provided are gold-coated flat silver particles, a dispersion including the gold-coated flat silver particles and a dispersion medium, a method of the dispersion, a coating film including the gold-coated flat silver particles, and an antireflection optical member. The gold-coated flat silver particles include flat silver particles and a gold coating layer, in which an average thickness of the gold coating layer on principal planes of the particles is 0.1 nm to 2 nm, and a ratio of the average thickness of the gold coating layer on the principal planes of the particles to an average thickness of the gold coating layer on edge surfaces of the particles is 0.02 or higher.
Systems, methods, and apparatus for production coatings of low-emissivity glass
Disclosed herein are systems, methods, and apparatus for forming low emissivity panels. In some embodiments, a partially fabricated panel may be provided that includes a substrate, a reflective layer formed over the substrate, and a barrier layer formed over the reflective layer such that the reflective layer is formed between the substrate and the barrier layer. The barrier layer may include a partially oxidized alloy of three or more metals. A first interface layer may be formed over the barrier layer. A top dielectric layer may be formed over the first interface layer. The top dielectric layer may be formed using reactive sputtering in an oxygen containing environment. The first interface layer may prevent further oxidation of the partially oxidized alloy of the three or more metals when forming the top dielectric layer. A second interface layer may be formed over the top dielectric layer.
HEAT-RAY SHIELDING PARTICLE DISPERSING LIQUID, HEAT-RAY SHIELDING PARTICLE DISPERSING BODY, HEAT-RAY SHIELDING LAMINATED TRANSPARENT SUBSTRATE AND HEAT-RAY SHIELDING TRANSPARENT SUBSTRATE
A heat-ray shielding particle dispersing liquid includes heat-ray shielding particles at least containing composite tungsten oxide particles and indium tin oxide particles, the weight ratio of the composite tungsten oxide particles and the indium tin oxide particles in the heat-ray shielding particles being within a range of composite tungsten oxide particles/indium tin oxide particles=99/1 to 22/78; and a liquid medium.
Glass articles with non-planar features and alkali-free glass elements
An electronic device assembly includes a backplane having a glass composition substantially free of alkali ions, an elastic modulus of about 40 GPa to about 100 GPa, and a final thickness from about 20 m to about 100 m. The primary surfaces of the backplane are characterized by a prior material removal to the final thickness from an initial thickness that is at least 20 m greater than the final thickness. The assembly also includes a protect layer on the first primary surface of the backplane; and a plurality of electronic components on the second primary surface of the backplane. In addition, the backplane is configured with at least one static bend having a bend radius between about 25 mm and about 5 mm. The electronic components of the electronic device assembly can include at least one thin film transistor (TFT) element or organic light emitting diode (OLED) element.
Surface-treated infrared absorbing fine particle dispersion liquid and infrared absorbing transparent substrate
A surface-treated infrared absorbing fine particle dispersion liquid wherein surface-treated infrared absorbing fine particles are dispersed in a liquid medium, and are an infrared absorbing transparent substrate having a coating layer in which the surface-treated infrared absorbing fine particles. This is a surface-treated infrared absorbing fine particle dispersion liquid in which surface treated infrared absorbing fine particles are dispersed in a liquid medium, wherein the surface-treated infrared absorbing fine particles are infrared absorbing fine particles, each surface is coated with a coating layer containing at least one selected from a hydrolysis product of a metal chelate compound, a polymer of the hydrolysis product of the metal chelate compound, a hydrolysis product of a metal cyclic oligomer compound, and a polymer of the hydrolysis product of the metal cyclic oligomer compound, and this is an infrared absorbing transparent substrate prepared using the surface-treated infrared absorbing fine particle dispersion liquid.