A bendable stack assembly that includes a glass element having a composition substantially free of alkali ions, an elastic modulus of about 40 GPa to about 100 GPa, a final thickness from about 20 μm to about 100 μm, a first primary surface substantially in tension upon a bending of the element, and a second primary surface substantially in compression upon the bending, the primary surfaces characterized by a prior material removal to the final thickness from an initial thickness that is at least 20 μm greater than the final thickness. The glass element also includes a protect layer on the first primary surface. In addition, the glass element is characterized by an absence of failure when the element is held during the bending at a bend radius of about 15 mm for at least 60 minutes at about 25 C and about 50% relative humidity.

Embodiments of a article including include a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.

Provided are gold-coated flat silver particles, a dispersion including the gold-coated flat silver particles and a dispersion medium, a method of the dispersion, a coating film including the gold-coated flat silver particles, and an antireflection optical member. The gold-coated flat silver particles include flat silver particles and a gold coating layer, in which an average thickness of the gold coating layer on principal planes of the particles is 0.1 nm to 2 nm, and a ratio of the average thickness of the gold coating layer on the principal planes of the particles to an average thickness of the gold coating layer on edge surfaces of the particles is 0.02 or higher.

A heat-ray shielding particle dispersing liquid includes heat-ray shielding particles at least containing composite tungsten oxide particles and indium tin oxide particles, the weight ratio of the composite tungsten oxide particles and the indium tin oxide particles in the heat-ray shielding particles being within a range of “composite tungsten oxide particles”/“indium tin oxide particles”=99/1 to 22/78; and a liquid medium.

An electronic device assembly includes a backplane having a glass composition substantially free of alkali ions, an elastic modulus of about 40 GPa to about 100 GPa, and a final thickness from about 20 μm to about 100 μm. The primary surfaces of the backplane are characterized by a prior material removal to the final thickness from an initial thickness that is at least 20 μm greater than the final thickness. The assembly also includes a protect layer on the first primary surface of the backplane; and a plurality of electronic components on the second primary surface of the backplane. In addition, the backplane is configured with at least one static bend having a bend radius between about 25 mm and about 5 mm. The electronic components of the electronic device assembly can include at least one thin film transistor (TFT) element or organic light emitting diode (OLED) element.

Embodiments of an article including a substrate and a patterned coating are provided. In one or more embodiments, when a strain is applied to the article, the article exhibits a failure strain of 0.5% or greater. Patterned coating may include a particulate coating or may include a discontinuous coating. The patterned coating of some embodiments may cover about 20% to about 75% of the surface area of the substrate. Methods for forming such articles are also provided.

There is provided a resin composition containing a resin (A), a light scattering agent (B), a solvent (C), and a leveling agent (H), in which the content ratio of the solvent (C) is 40% by mass or more and less than 74% by mass based on the total amount of the resin composition, and the content ratio of the leveling agent (H) is 0.01% by mass or more and 1% by mass or less based on the total amount of the resin composition.

Light-control panels including layered optical components are described in this application. An example of a light-control panel includes first and second glazing layers and first and second switchable components extending between the first and second glazing layers. The light-control panel also includes a thermal coating extending between the first switchable component and the first glazing layer and a filter extending between the first and second switchable components.

An article including a coating including a plurality of particles dispersed in a host material; and a plurality of optical elements embedded on a surface of the coating is disclosed. A method of making the coating, and the article is disclosed.

Light-control panels including layered optical components are described in this application. An example of a light-control panel includes first and second glazing layers and first and second switchable components extending between the first and second glazing layers. The light-control panel also includes a thermal coating extending between the first switchable component and the first glazing layer and a filter extending between the first and second switchable components.