C03C2218/115

METHOD AND APPARATUS FOR FABRICATION OF METAL-COATED OPTICAL FIBER, AND THE RESULTING OPTICAL FIBER

Method and apparatus for producing metal-coated optical fiber involves feeding a length of glass fiber through a first solution bath so as to plate a first predetermined metal on the glass fiber via electroless deposition. The length of glass fiber is passed continuously from the first solution bath to a second solution bath adapted to plate thereon a second predetermined metal via electrolytic plating such that the optical fiber contacts an electrode only after at least some of the second predetermined metal has been applied. The length of glass fiber may be passed continuously from the second solution bath to a third solution bath adapted to plate thereon a third predetermined metal via electrolytic plating.

Hermetic metallized via with improved reliability

According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

Coupled transmission line resonate RF filter
11367939 · 2022-06-21 · ·

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Method for preparing optical articles with multi-layer antireflective coatings

The present invention is directed to a method for preparing a coated optical article including providing a non-conductive substrate; forming a conductive coating layer over the substrate; electrodepositing a first electrodepositable coating composition over the conductive coating layer to form a first electrodeposited inorganic coating layer; and electrodepositing a second electrodepositable coating composition over the first electrodeposited coating layer to form a second electrodeposited inorganic coating layer thereover, thereby forming a multi-layer antireflective inorganic coating over the conductive coating layer. Each of the first electrodepositable coating composition and the second electrodepositable coating composition is different one from the other, and each includes a sol prepared from a composition of a metal oxide precursor and protic acid such that each coating composition is hydrolyzed. Coated optical articles are also provided.

GLASS BASED EMPTY SUBSTRATE INTEGRATED WAVEGUIDE DEVICES
20220173488 · 2022-06-02 ·

The present invention includes a method of creating high Q empty substrate integrated waveguide devices and/or system with low loss, mechanically and thermally stabilized in photodefinable glass ceramic substrate. The photodefinable glass ceramic process enables high performance, high quality, and/or low-cost structures. Compact low loss RF empty substrate integrated waveguide devices are a cornerstone technological requirement for RF systems, in particular, for portable systems.

Antiglare film-coated substrate, method for its production, and article

To provide a production method capable of producing an antiglare film-coated substrate having excellent antiglare performance in a short time, an antiglare film-coated substrate having excellent antiglare performance, and an article provided with the substrate. A method for producing an antiglare film-coated substrate 1 comprising a substrate 3 and an antiglare film 5 formed on the substrate 3, characterized by comprising a step of preparing a coating composition comprising at least one of a silica precursor (A) and particles (C), and a liquid medium (B), wherein the liquid medium (B) contains a liquid medium (B1) having a boiling point of at most 150° C. in an amount of at least 86 mass % based on the total amount of the liquid medium (B), a step of electrically charging and spraying the coating composition by using an electrostatic coating apparatus having an electrostatic coating gun having a rotary atomizing head, to apply it on the substrate 3 to form a coating film, and a step of firing the coating film to form an antiglare film 5.

Coupled Transmission Line Resonate RF Filter
20220278435 · 2022-09-01 ·

The present invention includes a method of creating electrical air gap low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. Where a ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

Translucent structure

The present invention relates to a translucent structure having a surface unevenness shape which has: an area ratio of surface flat regions in which an angle formed with a flat surface is in a range of 0° to 0.5° of in a range of 0% to 5.8%; a projection density of in a range of 0.0001/μm.sup.2 to 0.05/μm.sup.2; a projection area ratio of in a range of 5.5% to 50%; a skewness Ssk which represents the degree of non-symmetry of in a range of −0.5 to 1.1; a load area factor Smr1 at a boundary between a projected mountain portion and a core portion of in a range of 0% to 14.5%; and an arithmetic average surface roughness Sa of in a range of 0.06 μm to 0.143 μm.

PLATING FILM AND PLATING FILM PRODUCTION METHOD

The present invention provides a plating film that exhibits good adhesion to glass substrates. The present invention is a plating film comprising an oxide layer, an electroless plating film, and an electrolytic copper plating film in this order.

Hermetic metallized via with improved reliability

An article includes a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and at least one via extending through the substrate from the first major surface to the second major surface over an axial length in an axial dimension. The article also includes a metal connector disposed within the via that hermetically seals the via. The article has a helium hermeticity of less than or equal to 1.0×10.sup.−8 atm-cc/s after 1000 thermal shock cycles, each of the thermal shock cycle comprises cooling the article to a temperature of −40° C. and heating the article to a temperature of 125° C., and the article has a helium hermeticity of less than or equal to 1.0×10.sup.−8 atm-cc/s after 100 hours of HAST at a temperature of 130° C. and a relative humidity of 85%.