A device for heat treating a coating deposited on a substrate includes a treatment module opposite which the substrate runs, the treatment module including a laser source generating a laser beam of energy, a splitter module to split the beam into a multitude of secondary beams, having an energy En to treat the coating, that have the form of a point, a scanner allowing each secondary beam to be displaced in the running direction according to a first amplitude and first velocity and/or in a direction orthogonal to the running direction according to second amplitude and second velocity; and a displacement system to create, in operation, a relative displacement movement between the substrate and the or each treatment module.

There is provided a three-dimensional structure in which a multilayer film is three-dimensionally curved to form an interior space. The multilayer film includes a layer containing a carbon monoatomic layer substance, a support layer, and a curve induction layer that induces a curved structure, where the layer containing the carbon monoatomic layer substance is in contact with the interior space, and the support layer is positioned between the layer containing the carbon monoatomic layer substance and the curve induction layer.

Disclosed herein are graphene coatings characterized by a porous, three-dimensional, spherical structure having a hollow core, along with methods for forming such graphene coatings on glasses, glass-ceramics, ceramics, and crystalline materials. Such coatings can be further coated with organic or inorganic layers and are useful in chemical and electronic applications.

Disclosed herein are graphene coatings characterized by a porous, three-dimensional, spherical structure having a hollow core, along with methods for forming such graphene coatings on glasses, glass-ceramics, ceramics, and crystalline materials. Such coatings can be further coated with organic or inorganic layers and are useful in chemical and electronic applications.

A method to transfer a layer of harder thin film substrate onto a softer, flexible substrate. In particular, the present invention provides a method to deposit a layer of sapphire thin film on to a softer and flexible substrate e.g. quartz, fused silica, silicon, glass, toughened glass, PET, polymers, plastics, paper and fabrics. This combination provides the hardness of sapphire thin film to softer flexible substrates.

Disclosed herein are nanostructured plasmonic materials. The nanostructured plasmonic materials can include a first nanostructured layer comprising: a first layer of a first plasmonic material permeated by a first plurality of spaced-apart holes, wherein the first plurality of spaced apart holes comprise a first array; and a second nanostructured layer comprising a second layer of a second plasmonic material permeated by a second plurality of spaced-apart holes, wherein the second plurality of spaced apart holes comprise a second array; wherein the second nanostructured layer is located proximate the first nanostructured layer; and wherein the first principle axis of the first array is rotated at a rotation angle compared to the first principle axis of the second array.

A clothing care apparatus comprises: a body including a clothing care room; and a door rotatably coupled to the body and including a control panel formed at the front surface thereof, wherein the control panel comprises: glass; a coating layer provided on the glass while having an aperture; a first print layer laminated on the coating layer and having a shape corresponding to the coating layer; and a second print layer laminated on the first print layer and provided adjacent to the glass.

Described herein are organosilicon modification layers and associated deposition methods and inert gas treatments that may be applied on a sheet, a carrier, or both, to control van der Waals, hydrogen and covalent bonding between a sheet and carrier. The modification layers bond the sheet and carrier together such that a permanent bond is prevented at high temperature processing as well as maintaining a sufficient bond to prevent delamination during high temperature processing.

An electronic package assembly includes a glass substrate including an upper glass cladding layer, a lower glass cladding layer, a glass core layer coupled to the upper glass cladding layer and the lower glass cladding layer, where the upper glass cladding layer and the lower glass cladding layer have a higher etch rate in an etchant than the glass core layer, a first cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, and a second cavity positioned within one of the upper glass cladding layer or the lower glass cladding layer, a microprocessor positioned within the first cavity, and a micro-electronic component positioned within the second cavity.

A substrate, a method for separating the substrate, and a display panel are provided. The substrate is disposed on a glass substrate. The substrate includes a substrate layer and a sacrificial layer. The sacrificial layer disposed between the substrate layer and the glass substrate, and is configured to share the force exerted on the substrate layer when the substrate is being separated from the glass substrate.