A method of processing a glass material includes guiding and/or focusing light from a light source to glass material in a hot stage of a processing system, where the light source provides light at a wavelength λ that interacts with crystals that may be formed in the glass material. The method includes collecting and/or guiding light directed from the glass material in the hot stage to a wavelength separator, and separating the light directed from the glass material to provide a spectrum δ having wavelengths that are within about twenty nanometers of the wavelength λ. The method includes observing with a detector light of the spectrum δ to identify nano-scale shifts in the wavelength λ caused by interaction with crystals, if present, within the glass material in the hot stage of the processing system.

Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

A process that anneals a surface of a substrate bearing a coating includes running the substrate under a flash lamp emitting intense pulsed light and irradiating the coating with the pulsed light through a mask located between the flash lamp and the coating. A frequency of the flash lamp and a run speed of the substrate are adjusted so that each point of the coating to be annealed receives at least one light pulse. A distance between a lower face of the mask and the surface of the coating to be annealed is at most equal to 1 mm. A shape and extent of a slit in the mask are such that the mask occults the coating to be annealed in all zones where the light intensity that, in an absence of the mask, would arrive at the coating to be annealed is lower than a threshold light intensity.

A method of processing a glass material includes guiding and/or focusing light from a light source to glass material in a hot stage of a processing system, where the light source provides light at a wavelength λ that interacts with crystals that may be formed in the glass material. The method includes collecting and/or guiding light directed from the glass material in the hot stage to a wavelength separator, and separating the light directed from the glass material to provide a spectrum δ having wavelengths that are within about twenty nanometers of the wavelength λ. The method includes observing with a detector light of the spectrum δ to identify nano-scale shifts in the wavelength λ caused by interaction with crystals, if present, within the glass material in the hot stage of the processing system.

Methods of forming vias in substrates having at least one damage region extending from a first surface etching the at least one damage region of the substrate to form a via in the substrate, wherein the via extends through the thickness T of the substrate while the first surface of the substrate is masked. The mask is removed from the first surface of the substrate after etching and upon removal of the mask the first surface of the substrate has a surface roughness (Rq) of about less than 1.0 nm.

An apparatus for manufacturing a glass article includes a plurality of side portions spaced apart from each other; and a plurality of heat supply portions disposed on each of the side portions; where the side portions adjacent to each other are disposed to face each other, and a glass is allowed to be disposed between the adjacent side portions.

The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.

A method for forming a via in a glass article includes forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate including a glass cladding layer and a glass central core layer, where the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and where the one or more cavities extend through the glass central core layer terminating at the glass cladding layer, depositing a metallic material within the one or more cavities, and removing the glass cladding layer.

The invention relates to a process for obtaining a material comprising a substrate coated on at least one part of at least one of its faces with at least one functional layer, said process comprising: a step of depositing the or each functional layer, then a step of depositing a sacrificial layer on said at least one functional layer, then a step of heat treatment by means of radiation chosen from laser radiation or radiation from at least one flash lamp, said radiation having at least one treatment wavelength between 200 and 2500 nm, said sacrificial layer being in contact with the air during this heat treatment step, then a step of removing the sacrificial layer using a solvent, said sacrificial layer being a monolayer and being such that, before heat treatment, it absorbs at least one part of said radiation at said at least one treatment wavelength and that, after heat treatment, it is capable of being removed by dissolution and/or dispersion in said solvent.

The present invention includes a method of creating electrical air gap or other low loss low cost RF mechanically and thermally stabilized interdigitated resonate filter in photo definable glass ceramic substrate. A ground plane may be used to adjacent to or below the RF filter in order to prevent parasitic electronic signals, RF signals, differential voltage build up and floating grounds from disrupting and degrading the performance of isolated electronic devices by the fabrication of electrical isolation and ground plane structures on a photo-definable glass substrate.