Strengthened glass articles formed from a glass composition comprising less than 1.0 mol % R.sub.2O, where R is an alkali ion, are disclosed. In various embodiments, the glass articles have a dielectric constant of less than 6.25 and a dielectric loss tangent of less than 0.01 at 30 GHz. Electronic devices, such as consumer electronic products, including the strengthened glass articles, as well as methods of making the strengthened glass articles are also disclosed.

A glass container includes a glass body comprising an external surface, an internal surface opposite the external surface, a thickness T extending between the external surface and the internal surface, and an external surface layer extending from the external surface into the thickness of the glass body, wherein the external surface layer has a porosity greater than a porosity of a remainder of the glass body extending from the external surface layer to the internal surface.

A glass container includes a glass body comprising an external surface, an internal surface opposite the external surface, a thickness T extending between the external surface and the internal surface, and an external surface layer extending from the external surface into the thickness of the glass body, wherein the external surface layer has a porosity greater than a porosity of a remainder of the glass body extending from the external surface layer to the internal surface.

A glass composition includes from 55.0 mol % to 75.0 mol % SiO.sub.2; from 8.0 mol % to 20.0 mol % Al.sub.2O.sub.3; from 3.0 mol % to 15.0 mol % Li.sub.2O; from 5.0 mol % to 15.0 mol % Na.sub.2O; and less than or equal to 1.5 mol % K.sub.2O. The glass composition has the following relationships: Al.sub.2O.sub.3+Li.sub.2O is greater than 22.5 mol %, R.sub.2O+RO is greater than or equal to 18.0 mol %, R.sub.2O/Al.sub.2O.sub.3 is greater than or equal to 1.06, SiO.sub.2+Al.sub.2O.sub.3+B.sub.2O.sub.3+P.sub.2O.sub.5 is greater than or equal to 78.0 mol %, and (SiO.sub.2+Al.sub.2O.sub.3+B.sub.2O.sub.3+P.sub.2O.sub.5)/Li.sub.2O is greater than or equal to 8.0. The glass composition may be used in a glass article or a consumer electronic product.

A glass composition includes from 55.0 mol % to 75.0 mol % SiO.sub.2; from 8.0 mol % to 20.0 mol % Al.sub.2O.sub.3; from 3.0 mol % to 15.0 mol % Li.sub.2O; from 5.0 mol % to 15.0 mol % Na.sub.2O; and less than or equal to 1.5 mol % K.sub.2O. The glass composition has the following relationships: Al.sub.2O.sub.3+Li.sub.2O is greater than 22.5 mol %, R.sub.2O+RO is greater than or equal to 18.0 mol %, R.sub.2O/Al.sub.2O.sub.3 is greater than or equal to 1.06, SiO.sub.2+Al.sub.2O.sub.3+B.sub.2O.sub.3+P.sub.2O.sub.5 is greater than or equal to 78.0 mol %, and (SiO.sub.2+Al.sub.2O.sub.3+B.sub.2O.sub.3+P.sub.2O.sub.5)/Li.sub.2O is greater than or equal to 8.0. The glass composition may be used in a glass article or a consumer electronic product.

According to one embodiment, a glass may include from about 50 mol. % to about 70 mol. % SiO.sub.2; from about 12 mol. % to about 35 mol. % B.sub.2O.sub.3; from about 4 mol. % to about 12 mol. % Al.sub.2O.sub.3; greater than 0 mol. % and less than or equal to 1 mol. % alkali metal oxide, wherein Li.sub.2O is greater than or equal to about 20% of the alkali metal oxide; from about 0.3 mol. % to about 0.7 mol. % of Na.sub.2O or Li.sub.2O; and greater than 0 mol. % and less than 12 mol. % of total divalent oxide, wherein the total divalent oxide includes at least one of CaO, MgO and SrO, and wherein a ratio of Li.sub.2O (mol. %) to (Li.sub.2O (mol. %)+(Na.sub.2O (mol. %)) is greater than or equal 0.4 and less than or equal to 0.6. The glass may have a relatively low high temperature resistivity and a relatively high low temperature resistivity.

According to one embodiment, a glass may include from about 50 mol. % to about 70 mol. % SiO.sub.2; from about 12 mol. % to about 35 mol. % B.sub.2O.sub.3; from about 4 mol. % to about 12 mol. % Al.sub.2O.sub.3; greater than 0 mol. % and less than or equal to 1 mol. % alkali metal oxide, wherein Li.sub.2O is greater than or equal to about 20% of the alkali metal oxide; from about 0.3 mol. % to about 0.7 mol. % of Na.sub.2O or Li.sub.2O; and greater than 0 mol. % and less than 12 mol. % of total divalent oxide, wherein the total divalent oxide includes at least one of CaO, MgO and SrO, and wherein a ratio of Li.sub.2O (mol. %) to (Li.sub.2O (mol. %)+(Na.sub.2O (mol. %)) is greater than or equal 0.4 and less than or equal to 0.6. The glass may have a relatively low high temperature resistivity and a relatively high low temperature resistivity.

A glass substrate has a compaction of 0.1 to 100 ppm. An absolute value |Δα.sub.50/100| of a difference between an average coefficient of thermal expansion α.sub.50/100 of the glass substrate and an average coefficient of thermal expansion of single-crystal silicon at 50° C. to 100° C., an absolute value |Δα.sub.100/200| of a difference between an average coefficient of thermal expansion α.sub.100/200 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 100° C. to 200° C., and an absolute value |Δα.sub.200/300| of a difference between an average coefficient of thermal expansion α.sub.200/300 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 200° C. to 300° C. are 0.16 ppm/° C. or less.

A glass substrate has a compaction of 0.1 to 100 ppm. An absolute value |Δα.sub.50/100| of a difference between an average coefficient of thermal expansion α.sub.50/100 of the glass substrate and an average coefficient of thermal expansion of single-crystal silicon at 50° C. to 100° C., an absolute value |Δα.sub.100/200| of a difference between an average coefficient of thermal expansion α.sub.100/200 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 100° C. to 200° C., and an absolute value |Δα.sub.200/300| of a difference between an average coefficient of thermal expansion α.sub.200/300 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 200° C. to 300° C. are 0.16 ppm/° C. or less.

The embodiments described herein relate to low temperature moldable sheet forming glass compositions and glass articles formed from the same. In various embodiments, the glass composition comprises from about 60 mol. % to about 67 mol. % SiO.sub.2, from about 6 mol. % to about 11 mol. % B.sub.2O.sub.3, from about 4.5 mol. % to about 11 mol. % Li.sub.2O, Al.sub.2O.sub.3, Na.sub.2O, and K.sub.2O. The glass composition also includes greater than about 2 mol. % RO, where RO are divalent metal oxides, and R.sub.2O from about 14 mol. % to about 20 mol. %, where R.sub.2O are alkali metal oxides. The glass composition also has a glass transition temperature T.sub.g of less than about 500 C, a softening point of less than about 650 C, and a coefficient of thermal expansion (CTE) of less than about 85×10.sup.−7 K.sup.−1.