The invention belongs to the field of electronic ceramics and its manufacturing, in particular to the modified NiTa.sub.2O.sub.6-based microwave dielectric ceramic material co-sintered at low temperature and its preparation method. Based on the low melting point characteristics of CuO and B.sub.2O.sub.3, and the radius of Cu.sup.2+ ions is similar to that of Ni.sup.2+ and Ta.sup.5+ ions, the chemical general formula of the invention is designed as xCuO-(1-x)NiO-[7.42y+(xy/14.33)]B.sub.2O.sub.3—Ta.sub.2O.sub.5, and the molar content of each component is adjusted from raw materials. The main crystalline phase of NiTa.sub.2O.sub.6 is synthesized at a lower pre-sintering temperature, and NiTa.sub.2O.sub.6-based ceramic material with low-temperature sintering characteristics and excellent microwave dielectric properties are directly synthesized at one time, which broadened the application range in LTCC field.

The present disclosure relates to a micromesh proppant for use in hydraulic fracturing of oil and gas wells. In one embodiment, a process for forming proppant particles includes providing a slurry comprising a ceramic raw material containing alumina, atomizing the slurry into droplets, coating seeds comprising alumina with the droplets to form green pellets, sintering the green pellets to form sintered pellets, and breaking the sintered pellets to form proppant particles comprising a sintered ceramic material and having a size of from about 150 mesh to about 500 mesh and a crush strength at 7,500 psi of from about 1% to about 20%. In one embodiment, a proppant particle includes a sintered ceramic material and having a size of from about 150 mesh to about 500 mesh and a crush strength at 7,500 psi of from about 1% to about 20%.

Provided is an improved multilayered ceramic capacitor and an electronic device comprising the multilayered ceramic capacitor. The multilayer ceramic capacitor comprises first conductive plates electrically connected to first external terminations and second conductive plates electrically connected to second external terminations. The first conductive plates and second conductive plates form a capacitive couple. A ceramic portion is between the first conductive plates and said second conductive plates wherein the ceramic portion comprises paraelectric ceramic dielectric. The multilayer ceramic capacitor has a rated DC voltage and a rated AC V.sub.PP wherein the rated AC V.sub.PP is higher than the rated DC voltage.

The present invention relates to a mesoporous silica/ceria-silica composite and a method for preparing a mesoporous composite and, more specifically, to a mesoporous silica/ceria-silica composite which is composed of mesoporous silica having a hexagonal or cubic structure and ceria having a hexagonal structure provided on a surface and pores of the mesoporous silica, the oxidation state of the ceria being Ce.sup.4+ and Ce.sup.3+.

Methods of forming structures including a substrate (e.g., ceramic) and an interface layer comprising a metal are disclosed. Structures and electrochemical cells and batteries are also disclosed. Exemplary methods include flash sintering of metal and ceramic materials. Various structures may be suitable for use as solid electrolytes in solid-state electrochemical cells, as well as for many other applications.

The polymer film of the present invention has through holes extending from one principal surface of the polymer film to the other principal surface of the polymer film. The through holes are straight holes having a central axis extending straight, and have a shape in which the area of a cross-section perpendicular to the direction of the central axis increases from the one principal surface of the polymer film toward the other principal surface. This polymer film has passages in its thickness direction, has an unconventional structure, and can be used in various applications, such as in a waterproof sound-permeable membrane, in a waterproof gas-permeable membrane, and in a suction sheet. The ratio a/b of the opening diameter a of the through holes at the one principal surface to the opening diameter b of the through holes at the other principal surface is 80% or is less than 80%.

A method for producing a ceramic matrix composite (CMC) material includes impregnating a set of ceramic fibers with a non-fibrous ceramic material, resulting in a precursor matrix, stabilizing the precursor matrix, resulting in a stabilized matrix, and densifying the stabilized matrix using a frequency assisted sintering technology (FAST) process, resulting in a densified CMC material. The resulting densified CMC exhibits superior strength and toughness, relative to prior CMCs.

Some phosphor powders can be difficult to form into ceramic compacts because they are difficult to sinter. As described herein, phosphor powders that can degrade under conventional sintering temperatures can be sintered by heating the powder at a lower temperature, such as less than 800° C., while the powder is under greater than atmospheric pressure, such as at least 0.05 GPa. Phosphor ceramic compacts prepared by this method, and light-emitting devices incorporating these phosphor ceramic compacts, are also described.

An apparatus for three-dimensional laminating and coloring a dental ceramic crown includes a slurry layering module, a coloring module, a light curing module and a main controller. The main controller controls the slurry layering module to lay a slurry from a slurry tank to form a slurry layer, controls the coloring module to color the slurry layer with the colorant in a color tank to form a colorant layer according to a plurality of coloring parameter data, controls the light curing module to cure the slurry layer according to a plurality of laminated graphics. The apparatus may color each slurry layer, and the color can be easily changed as desired. The overall coloring effect of the dental ceramic crown is natural with good light transmittance, and the color is saturated without any blooming formed between the colored layers.

A method of manufacturing a multilayer ceramic capacitor includes printing an internal electrode pattern on a dielectric layer, forming a dielectric pattern in a region other than a region in which the internal electrode pattern is printed, laminating dielectric layers to form a multilayer body, exposing the internal electrode pattern and the dielectric pattern from a side surface of the multilayer body, removing at least a portion of the exposed dielectric pattern, and forming a dielectric gap layer on the side surface.