C04B2237/32

Method for manufacturing sensor element

A method for manufacturing a sensor element that includes: a pair of electrodes; a ceramic layer having a hollow space that is to be an air introduction hole; and a first layer and a second layer stacked at both surfaces of the ceramic layer, One of the electrodes is in communication with the hollow space, The method includes: preparing an unsintered ceramic sheet, and a burn-out material sheet having a thickness different from that of the unsintered ceramic sheet, the burn-out material sheet having, in a plane orthogonal to the direction of an axial line O, a cross-sectional area substantially identical to a cross-sectional area of the pre-sintering hollow space; placing the burn-out material sheet in the pre-sintering hollow space; pressing the sheets so as to have an identical thickness; and burning out the burn-out material sheet.

Copper-ceramic composite

A copper-ceramic composite: includes a ceramic substrate containing alumina and a copper or copper alloy coating on the ceramic substrate. The alumina has a mean grain shape factor R.sub.a(Al.sub.2O.sub.3), defined as the arithmetic mean of the shape factors R of the alumina grains, of at least 0.4.

Low thermal stress engineered metal structures
11597013 · 2023-03-07 · ·

A structured multi-phase composite which include a metal phase, and a low stiffness, high thermal conductivity phase or encapsulated phase change material, that are arranged to create a composite having high thermal conductivity, having reduced/controlled stiffness, and a low CTE to reduce thermal stresses in the composite when exposed to cyclic thermal loads. The structured multi-phase composite is useful for use in structures such as, but not limited to, high speed engine ducts, exhaust-impinged structures, heat exchangers, electrical boxes, heat sinks, and heat spreaders.

ELECTRONIC DEVICE HOUSING AND ELECTRONIC DEVICE INCLUDING THE SAME
20230065427 · 2023-03-02 ·

An electronic device housing, and an electronic device including the same are provided. The electronic device housing includes a substrate including glass, an insert portion which is bonded to the substrate at a surface of the insert portion, and at which a functional component of an electronic device having the electronic device housing is disposed, and an elastic layer which is between the substrate and the insert portion and extends along the surface of the insert portion.

Composite component for horology or jewellery with a ceramic structure and inserts
11625007 · 2023-04-11 · ·

A method for fabricating a composite component for horology or jewellery including making a base from a first material, with a first visible apparent surface, and a first support surface; a structure from a second ceramic, or sapphire or at least partially amorphous material, with a second apparent surface and a second support surface, including a through bore machined over the entire thickness thereof; at least one insert made of a third material, for each through bore, and arranged to fit together in a complementary manner with this through bore; bonding this base and each structure to each other, with each first support surface and each second complementary support surface bearing against one another; securing each insert with its respective through bore.

STRUCTURE BODY, STRUCTURE BODY MANUFACTURING METHOD, AND ELECTRONIC APPARATUS

A structure body according to an embodiment of the present disclosure includes: a first base having one surface, and having a density lower than a density that is determined by a crystal structure and a composition of a constituent material; a second base disposed to face the one surface of the first base; and a buffer layer provided between the first base and the second base, and containing at least a metal element.

Ceramic substrate with glass fill for decoration and housing materials
11667585 · 2023-06-06 · ·

A ceramic composite article includes a substrate including a matrix of ceramic material defining a network of interstitial regions and a transparent material occupying at least some of the interstitial regions of the substrate. The transparent material can have a melting point lower than a melting point of the ceramic material. The matrix of ceramic material can be formed by a 3D printing process.

Tape casting using slurry from a cavitation apparatus and methods of making same

Provided in one embodiment is a method of making, comprising: applying a hydrodynamic cavitation process to a raw material comprising particles comprising a metal-containing material or a carbon containing material of a first size to produce a slurry having particles comprising the metal-containing material or the carbon-containing material of a second size, smaller than the first size; and tape casting the slurry to form a green tape. Apparatuses employed to apply the method and the exemplary compositions made in accordance with the method are also provided.

LASER JOINING OF CMC STACKS
20170268344 · 2017-09-21 ·

A method of manufacturing a gas turbine engine component (10) and the component so formed. The method includes: stacking a plurality of CMC layers (16) along a metal core (30) to form a stack of disconnected CMC layers, wherein adjacent edge faces (46) of the layers define a surface (44); additively depositing ceramic material (14) to only selected portions of the surface (44) to bond together at least some of the layers at their respective edge faces; and selecting locations for the depositing of the ceramic material to achieve a predetermined mechanical characteristic of the resulting component.

FAST-DENSIFIED CERAMIC MATRIX COMPOSITE AND FABRICATION METHOD
20170320784 · 2017-11-09 ·

A method for producing a ceramic matrix composite (CMC) material includes impregnating a set of ceramic fibers with a non-fibrous ceramic material, resulting in a precursor matrix, stabilizing the precursor matrix, resulting in a stabilized matrix, and densifying the stabilized matrix using a frequency assisted sintering technology (FAST) process, resulting in a densified CMC material. The resulting densified CMC exhibits superior strength and toughness, relative to prior CMCs.