The object of the present invention is an integrally bonded composite component, a method for the production thereof, and the use thereof. The invention particularly relates to integrally bonded transparent ceramic composite components, to a method for the production of such ceramic composite components, and to the use thereof.

Provided are a manufacturing method for a composite wafer and a composite wafer obtained by using the manufacturing method, the manufacturing method including: preparing a first substrate in which a first layer of any one of oxides, oxynitrides, and nitrides is disposed on one surface; preparing a second substrate in which a second layer of any one of oxides, oxynitrides, and nitrides is disposed on one surface; forming a silicon layer on a surface of one of the first layer or the second layer; activating, with plasma, a surface of at least one of the silicon layer or another of the first layer or the second layer; and bonding the first substrate and the second substrate.

The object of the present invention is an integrally bonded composite component, a method for the production thereof, and the use thereof. The invention particularly relates to integrally bonded transparent ceramic composite components, to a method for the production of such ceramic composite components, and to the use thereof.

A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.

A ceramic matrix composite component includes a first substrate and a second substrate each formed of a silicide-containing ceramic matrix composite, silicon carbide layers respectively coating a bonding surface of the first substrate and a bonding surface of the second substrate, and a bonding layer formed of a silicon-containing alloy and provided between the silicon carbide layer coating the bonding surface of the first substrate and the silicon carbide layer coating the bonding surface of the second substrate.

A method of brazing a sintered zirconia ceramic body, comprises: providing a sintered zirconia ceramic body having a surface; chemically reducing the sintered zirconia ceramic body in whole or in part to form a reduced surface to the sintered zirconia ceramic body; applying a brazing material to at least part of the reduced surface to form an assembly comprising said brazing material and sintered zirconia ceramic body; heating said assembly to a temperature sufficient to at least partially melt the brazing material such that the brazing material wets the reduced surface; and cooling the assembly to solidify the brazing material.

A sample holder includes a substrate composed of ceramics, having a sample holding surface provided in an upper face thereof; a supporting member composed of metal, an upper face of the supporting member covering a lower face of the substrate; and a joining layer composed of indium or an indium alloy, the substrate and the supporting member being joined to each other via the joining layer. The joining layer has a layer region in at least one of a joining surface to the substrate and a joining surface to the supporting member, a content percentage of indium oxides of the layer region being higher than that of an intermediate region in a thickness direction of the joining layer.

A method for joining a ceramic component to a metallic component is described. At least one layer of molybdenum is applied to a surface of the ceramic component, by a high-velocity molybdenum wire spray technique. A layer of a nickel-based braze composition is then applied over the molybdenum layer. The braze composition and the ceramic and metallic components are then heated to a sufficient brazing temperature, so as to provide a braze joint between the components. The method can be used to seal an open region of a thermal battery, e.g., a sodium metal halide-based battery.

An example method includes introducing a slurry comprising particles in a joint region between a first substrate including graphite and a second substrate including mullite. The particles include an ytterbium disilicate compound. The method may further include heating an assembly including the first substrate, the second substrate, and the slurry to form a joint between the first substrate and the second substrate.

Laminates and antenna-in-packaging include a plurality of substrates and a plurality of metallic traces disposed between adjacent pairs of substrates and extending through one or more vias in at least one substrate. An adjacent pair of metallic traces electrically connected through the one or more vias. The adjacent pair of substrates are bonded together by at least the metallic trace positioned therebetween. A metallic material of the plurality of metallic traces has an electrical conductivity at 20 C. of about 10.sup.5 S/m or more. Methods include disposing a first metallic trace on a first substrate followed by disposing a second substrate thereon and then disposing a second metallic traces thereon before heating the resulting assembly to form the laminate with the substrates bonded together by at least the metallic trace. Disposing the metallic trace can include disposing a conductive ink, for example, by aerosol jet printing.