C04B2237/66

Semiconductor substrate support with multiple electrodes and method for making same

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

Zirconia layered body

Provided is at least any of a layered body, which has a change in texture derived from zirconia, particularly a change in translucency and is suitable as a dental prosthetic member, a precursor thereof, or a method for producing these. There is provided a layered body having a structure in which two or more layers containing zirconia containing a stabilizer are layered, the layered body including at least: a first layer containing zirconia having a stabilizer content of higher than or equal to 4 mol %; and a second layer containing zirconia having a stabilizer content different from that of the zirconia contained in the first layer.

ZIRCONIA LAYERED BODY

A layered body, which has a change in texture derived from zirconia, particularly a change in translucency and is suitable as a dental prosthetic member, a precursor thereof, or a method for producing these. The layered body has a structure in which two or more layers containing zirconia containing a stabilizer are layered, the layered body including at least: a first layer containing zirconia having a stabilizer content of higher than or equal to 4 mol %; and a second layer containing zirconia having a stabilizer content different from that of the zirconia contained in the first layer. At least one layer contains one or more elements capable of coloring zirconia.

ZIRCONIA SINTERED BODY

The present invention provides a zirconia sintered body that has less excess material to be removed when making a prosthesis by milling, providing a reduction of work time, more durability for a working tool, and a faster treatment for patients, and that undergoes little deformation during firing, and provides enhanced aesthetics. The present invention relates to a columnar zirconia sintered body having a base and a side face, the base having a surface shape that is neither square nor rectangular but has at least one straight portion.

METHOD FOR PRODUCING A CERAMIC COMPONENT COMPOSED OF A PLURALITY OF JOINED PREFORMS AND COMPONENT OBTAINED BY THE METHOD

A method for producing a component includes a) providing at least two preforms each made of a carbon composite material, b) joining the at least two preforms at least at one respective connecting surface to form a composite, in which a joining compound is introduced between the joining surfaces of the preforms and then cured and the joining compound contains silicon carbide and at least one polymer adhesive, and c) siliconizing the composite to form the component. A component, such as an optical component produced thereby, is also provided.

CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR
20220208697 · 2022-06-30 ·

Provided are a ceramic substrate and a method of manufacturing the same, which suppress a warpage phenomenon caused by a difference in volumes occupied by upper and lower metal layers of a ceramic base material and controls areas of the upper and lower metal layers especially when thicknesses of the upper and lower metal layers on the ceramic base material are equal to each other, thereby reducing a defect rate of the ceramic substrate.

SILICON NITRIDE SUBSTRATE, SILICON NITRIDE-METAL COMPOSITE, SILICON NITRIDE CIRCUIT BOARD, AND SEMICONDUCTOR PACKAGE

A silicon nitride substrate includes silicon nitride and magnesium, in which when a surface of the silicon nitride substrate is analyzed with an X-ray fluorescence spectrometer under the specific Condition I, XB/XA is 0.8 or more and 1.0 or less.

SEMICONDUCTOR SUBSTRATE SUPPORT WITH MULTIPLE ELECTRODES AND METHOD FOR MAKING SAME
20220143726 · 2022-05-12 · ·

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

Semiconductor substrate support with multiple electrodes and method for making same

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

MULTI-LAYER CERAMIC PLATE DEVICE

An electrostatic chuck includes a ceramic top plate layer made of a beryllium oxide material, a ceramic bottom plate layer made of a beryllium oxide material, a ceramic middle plate layer disposed between the ceramic top plate layer and the ceramic bottom plate layer, an electrode layer disposed between the ceramic top plate layer and the ceramic middle plate layer, and a heater layer disposed between the ceramic middle plate layer and the ceramic bottom plate layer. The electrode layer joins and hermetically seals the ceramic top plate layer to the ceramic middle plate layer, and the heater layer joins and hermetically seals the ceramic middle plate layer to the ceramic bottom plate layer.